The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2026
Filed:
Oct. 02, 2023
Applicant:
Nxp Usa, Inc., Austin, TX (US);
Inventors:
Assignee:
NXP USA, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 74/01 (2026.01); H10W 42/00 (2026.01); H10W 70/05 (2026.01); H10W 70/65 (2026.01); H10W 72/00 (2026.01); H10W 90/00 (2026.01); H10W 72/30 (2026.01);
U.S. Cl.
CPC ...
H10W 42/121 (2026.01); H10W 70/05 (2026.01); H10W 70/65 (2026.01); H10W 74/01 (2026.01); H10W 90/701 (2026.01); H10W 72/07337 (2026.01); H10W 72/354 (2026.01); H10W 72/884 (2026.01); H10W 90/734 (2026.01); H10W 90/754 (2026.01);
Abstract
An apparatus includes a substrate including a planar surface. A die is attached to the planar surface of the substrate with an interposed die attach material. A solder mask is interposed between the die attach material and the planar surface. The solder mask includes a recessed portion extending beneath a periphery of the die, and the recessed portion is filled with a molding underfill.
Quick Actions:
Lim, Swee. (2026). Eliminating substrate metal cracks in a ball grid array package (U.S. Patent No. 12796475). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12796475
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile