Company Filing History:
Years Active: 2025
Title: The Innovative Contributions of Kabir Mirpuri
Introduction
Kabir Mirpuri is a notable inventor based in Scottsdale, AZ, who has made significant contributions to the field of semiconductor technology. With a total of 2 patents to his name, he has demonstrated a commitment to advancing electronic components and their functionalities.
Latest Patents
Mirpuri's latest patents include a semiconductor device package having a thermal dissipation feature and a method therefor. This innovative package includes a substrate with a semiconductor die mounted on its surface. A thermal conductive structure is affixed to the semiconductor die, which enhances thermal management. The design allows for a thermal conduction path between the semiconductor die and the distal end of the limb portion, improving the overall efficiency of the device.
Another significant patent involves substrate pad and die pillar design modifications to enable extreme fine pitch flip chip (FC) joints. This invention features a device die with conductive contacts and pillars that are affixed to the substrate. The design includes cavities in the conductive pillars, allowing for a solder material to form a conductive joint, thereby enhancing the reliability and performance of electronic components.
Career Highlights
Kabir Mirpuri is currently employed at NXP USA, Inc., where he continues to innovate and develop cutting-edge technologies in the semiconductor industry. His work has positioned him as a key player in the advancement of electronic components.
Collaborations
Throughout his career, Mirpuri has collaborated with talented individuals such as Scott M. Hayes and Michael B. Vincent. These collaborations have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.
Conclusion
Kabir Mirpuri's contributions to the semiconductor industry through his patents and collaborative efforts highlight his role as an influential inventor. His work continues to shape the future of electronic components and their applications.