The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Nov. 20, 2023
Applicant:
Nxp Usa, Inc., Austin, TX (US);
Inventors:
Michael B. Vincent, Chandler, AZ (US);
Nikita Mahjabeen, Austin, TX (US);
Assignee:
NXP USA, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 44/20 (2026.01); H10W 70/05 (2026.01); H10W 70/685 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01); H10W 72/00 (2026.01); H10W 72/90 (2026.01); H10W 80/00 (2026.01);
U.S. Cl.
CPC ...
H10W 44/20 (2026.01); H10W 70/05 (2026.01); H10W 70/685 (2026.01); H10W 74/016 (2026.01); H10W 74/111 (2026.01); H10W 90/00 (2026.01); H10W 44/216 (2026.01); H10W 44/248 (2026.01); H10W 72/07236 (2026.01); H10W 72/932 (2026.01); H10W 80/732 (2026.01); H10W 90/724 (2026.01);
Abstract
A radio frequency (RF) transition mechanism between an integrated circuit (IC) package and an interposer circuit board includes elongated structures to reduce a distance between conductors. Pairs of electrical interconnect pads on the IC package and/or pairs of electrical interconnect pads on the interposer circuit board are elongated on a common axis. The reduced distance between conductors reduces insertion loss at frequencies of interest.