The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2026
Filed:
Sep. 28, 2022
Nxp Usa, Inc., Austin, TX (US);
Michael B. Vincent, Chandler, AZ (US);
Scott M. Hayes, Chandler, AZ (US);
NXP USA, INC., Austin, TX (US);
Abstract
A method of forming a semiconductor device is provided. The method includes forming a conductive die connector having a first end connected to a die pad of a semiconductor die. A first encapsulant formulated for selective activation by way of a laser encapsulates at least a portion of the semiconductor die. A first conductive trace of a redistribution layer is formed by plating a conductive material on a first laser activated path on a first major surface of the first encapsulant. The first conductive trace is directly connected to a second end of the die connector. A second encapsulant formulated for selective activation by way of a laser encapsulates at least the first conductive trace and exposed portions of the first major surface of the first encapsulant.