The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Nov. 23, 2022
Applicant:
Nxp Usa, Inc., Austin, TX (US);
Inventors:
Ankur Shah, Chandler, AZ (US);
Michael B. Vincent, Chandler, AZ (US);
Assignee:
NXP USA, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 74/10 (2026.01); B29C 45/14 (2006.01); B29K 63/00 (2006.01); B29L 31/34 (2006.01); H10F 77/00 (2025.01); H10F 77/50 (2025.01); H10W 74/01 (2026.01); H10W 74/15 (2026.01); H10W 74/47 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 74/141 (2026.01); B29C 45/14639 (2013.01); H10F 77/50 (2025.01); H10W 74/016 (2026.01); H10W 74/147 (2026.01); B29K 2063/00 (2013.01); B29L 2031/3406 (2013.01); H10F 77/93 (2025.01); H10W 74/15 (2026.01); H10W 74/47 (2026.01); H10W 74/476 (2026.01); H10W 90/724 (2026.01); H10W 90/734 (2026.01); H10W 90/754 (2026.01);
Abstract
A device package is formed form a volume of molding material that encapsulates a component. Edges of the component are protected by encapsulated areas formed above the edges by a filler material prior to molding the component. The molding material also encapsulates the filler material and positioning of the filler material defines a location and dimensions of an aperture in the molding material that exposes a portion of a top surface of the component.