Chandler, AZ, United States of America

Ankur Shailesh Shah

This inventor holds 2 USPTO granted patents and 10 published patent applications. Top assignee: Nxp USA, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ankur Shailesh Shah. Retrieved from https://idiyas.com/inventor/ankur-shailesh-shah

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 2.4

ph-index = 1


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: Ankur Shailesh Shah: Innovator in Device Packaging Technology

Introduction

Ankur Shailesh Shah is a prominent inventor based in Chandler, AZ (US). He has made significant contributions to the field of device packaging technology, holding 2 patents that showcase his innovative approach to electronic device design.

Latest Patents

One of Ankur's latest patents is focused on the two-part molding of device packages with spacers. This invention involves forming a device package from a volume of molding material that encapsulates a component. The edges of the component are protected by encapsulated areas formed above the edges by a filler material prior to molding. The positioning of the filler material defines the location and dimensions of an aperture in the molding material, which exposes a portion of the top surface of the component.

Another notable patent is for device packages with integrated batteries. This innovation allows batteries to be incorporated directly above or below semiconductor die or other devices within the package. This design reduces package footprints while protecting batteries from exposure to high temperatures during assembly. It also safeguards molded portions of the package from stresses that may arise from battery swelling over its useful lifetime. One terminal of the battery is bonded to a conductive lead integrated within a molded cover, creating an electrically conductive bond.

Career Highlights

Ankur is currently employed at NXP USA, Inc., where he continues to develop cutting-edge technologies in device packaging. His work has significantly impacted the efficiency and reliability of electronic devices.

Collaborations

Ankur collaborates with talented coworkers, including Michael B. Vincent and Scott M. Hayes, who contribute to the innovative environment at NXP USA, Inc.

Conclusion

Ankur Shailesh Shah is a dedicated inventor whose work in device packaging technology has led to significant advancements in the field. His patents reflect a commitment to innovation and excellence in electronic design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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