The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2025
Filed:
Jul. 19, 2022
Nxp B.v., Eindhoven, NL;
Che Ming Fang, Kaohsiung, TW;
Kuan-Hsiang Mao, Kaohsiung, TW;
Yufu Liu, Taoyuan, TW;
Wen Hung Huang, Kaohsiung, TW;
NXP B.V., Eindhoven, NL;
Abstract
An IC package includes one or more microelectronic devices, a plurality of package bumps disposed at a first side, and a metal structure electrically connecting at least a first device contact pad of a first microelectronic device and at least a first package bump of the plurality of package bumps. The metal structure includes an RDL trace extending between a first region aligned with the first device contact pad and a second region aligned with the first package bump, wherein the first package bump is mechanically and electrically connected directly to the second region of the RDL trace. The metal structure further includes a first via extending between the first region of the RDL trace and the first device contact pad and further includes a set of one or more support studs extending from the second region to a support surface facing the first side.