Company Filing History:
Years Active: 2023-2025
Title: Innovations of Inventor Che Ming Fang in Semiconductor Technology
Introduction
Che Ming Fang is a prominent inventor based in Kaohsiung, Taiwan, known for his significant contributions in the field of semiconductor technology. With a total of three patents to his name, Fang has made notable advancements that enhance the functionality and efficiency of integrated circuit devices.
Latest Patents
Che Ming Fang's latest patents include two innovative methods for manufacturing packaged integrated circuit devices. The first patent focuses on "Dielectric Sidewall Protection and Sealing for Semiconductor Devices in a Wafer Level Packaging Process." This method involves providing a semiconductor wafer with multiple integrated circuit devices, forming a cut that reaches a specific depth without fully extending through the wafer. This cut exposes the edges of the integrated circuits and includes the deposition of a passivation layer for protection.
His second recent patent, "Backside and Sidewall Metallization of Semiconductor Devices," also addresses the construction of packaged integrated circuit devices. It incorporates a process that involves grinding the backside of the silicon wafer to a specified depth. Similar to his first patent, it involves forming a backside cut that exposes the edges of the integrated circuits and subsequently depositing a metallization layer for enhanced connectivity.
Career Highlights
Che Ming Fang is currently employed at NXP B.V., a leading global semiconductor company. His work and innovation have positioned him as a valuable asset to the organization, contributing to the ongoing efforts in developing cutting-edge semiconductor solutions.
Collaborations
Fang has collaborated with notable coworkers, including Kuan-Hsiang Mao and Wen Hung Huang. Together, they contribute to the innovative and research-driven environment at NXP B.V., advancing the frontiers of semiconductor technologies through teamwork and shared expertise.
Conclusion
Che Ming Fang exemplifies the spirit of innovation in the semiconductor industry through his patents and collaborative efforts. His work continues to pave the way for improvements in integrated circuit packaging processes, showcasing the critical role of inventors in driving technological advancement.