This inventor holds 256 USPTO granted patents and 32 published patent applications and 5 EPO patents, primarily in Semiconductor Packaging (CPC class H01L23-49562). Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag, Qimonda Ag. Active years: 2004-2026.
Inventors with similar research interests:
Location History:
- München, DE (2004)
- Kaufeuren, DE (2007 - 2009)
- Kaulbeuren, DE (2009)
- Kautbeuren, DE (2009)
- Kaufbeuern, DE (2008 - 2013)
- Kaufbeuren, DE (2006 - 2024)
Company Filing History:
182 out of 15,016 
72 out of 2,195 
1 out of 555 
Years Active: 2004-2026
Areas of Expertise:
Title: Ralf Otremba: Innovator in Semiconductor Packaging
Introduction:
In the world of semiconductor packaging, Ralf Otremba has made his mark as a prolific inventor. With a location in Kaufbeuren, Germany, Otremba has obtained an impressive number of patents and has worked with renowned companies such as Infineon Technologies AG and Qimonda AG. This article explores his recent inventions, career highlights, notable collaborations, and the significance of his contributions to the field.
Latest Patents:
Ralf Otremba's latest patents showcase his expertise in developing innovative solutions for semiconductor packaging. One notable patent is the "Semiconductor Package and Method of Forming a Semiconductor Package." This invention presents a semiconductor package design that includes a semiconductor chip with a contact pad, a conductor element overlapping the contact pad, electrically conductive spacers, and adhesive systems to connect these elements. The result is a package that ensures efficient electrical conductivity and mechanical stability.
Another recent patent, titled "Semiconductor Package and Method for Fabricating a Semiconductor Package," focuses on a power semiconductor chip made of Silicon Carbide (SiC) and a leadframe part made of copper. The patent highlights the use of a solder joint with intermetallic phases to establish a reliable electrical and mechanical connection between the chip and the leadframe. These innovations contribute to enhanced performance and durability of semiconductor packages.
Career Highlights:
Ralf Otremba's career journey has been marked by significant contributions to the field of semiconductor packaging. Throughout his tenure at companies like Infineon Technologies AG and Qimonda AG, he has demonstrated a consistent drive for innovation. With a portfolio of 233 patents to his name, Otremba has undoubtedly played a vital role in advancing the technology and functionalities of semiconductor packaging.
Collaborations:
Innovation is often the result of collaboration, and Ralf Otremba has had the privilege of working with accomplished professionals in the field. Among his notable coworkers are Klaus Schiess and Josef Hoeglauer. These collaborations have allowed him to exchange ideas, leverage expertise, and jointly develop groundbreaking solutions in semiconductor packaging.
Conclusion:
Ralf Otremba's inventive spirit and expertise in semiconductor packaging have propelled him to the forefront of the industry. With a multitude of patents under his belt, Otremba's contributions have undoubtedly influenced the field's technological advancements. His commitment to improving electrical conductivity, mechanical stability, and overall performance in semiconductor packages continues to enhance the functionality and reliability of diverse electronic devices. As an innovator and inventor, Otremba remains an inspiring figure in the world of advancements in semiconductor packaging.
Please note: The information provided is based on the data given in the user's query and does not guarantee complete accuracy.