The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2025
Filed:
May. 16, 2023
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Ralf Otremba, Kaufbeuren, DE;
Paul Frank, Villach, AT;
Alexander Heinrich, Bad Abbach, DE;
Alexandra Ludsteck-Pechloff, Unterhaching, DE;
Daniel Pedone, Munich, DE;
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49513 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 21/78 (2013.01); H01L 23/49579 (2013.01); H01L 2224/2745 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/32507 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/8381 (2013.01); H01L 2224/8382 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/15747 (2013.01);
Abstract
A semiconductor package includes a power semi conductor chip comprising SiC, a leadframe part including Cu, wherein the power semiconductor chip is arranged on the leadframe part, and a solder joint electrically and mechanically coupling the power semiconductor chip to the leadframe part, wherein the solder joint includes at least one intermetallic phase.