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For the Inventor, By the Inventor

Bad Abbach, Germany

Alexander Heinrich

USPTO Granted Patents = 59 

 

Average Co-Inventor Count = 3.0

ph-index = 3

Forward Citations = 61(Granted Patents)

DiyaCoin DiyaCoin = 0.13 


Inventors with similar research interests:


Location History:

  • Hannover, DE (2022)
  • Regensburg, DE (2011 - 2023)
  • Donaustauf, DE (2021 - 2023)
  • Bad Abbach, DE (2017 - 2024)

Company Filing History:

goldMedal45 out of 14,705 
 
Infineon Technologies Ag
 patents
silverMedal8 out of 2,093 
 
Infineon Technologies Austria Ag
 patents
bronzeMedal6 out of 2,388 
 
Continental Automotive Gmbh
 patents

Years Active: 2011-2025

where 'Filed Patents' based on already Granted Patents

59 patents (USPTO):
1. 12347805 - Inkjet printing of diffusion solder (2025-07-01),
2. 12330243 - Method of forming an intermetallic phase layer with a plurality of nickel particles (2025-06-17),
3. 12261144 - Semiconductor device and method for fabricating a semiconductor device (2025-03-25),
4. 12255168 - Electronic device with multi-layer contact and system (2025-03-18),
5. 12205870 - Semiconductor package and method for fabricating a semiconductor package (2025-01-21),
6. 12166005 - Semiconductor device having a soldered joint with one or more intermetallic phases (2024-12-10),
7. 12069802 - Pre-plating of solder layer on solderable elements for diffusion soldering (2024-08-20),
8. 12027490 - Semiconductor device and method for fabricating the same (2024-07-02),
9. 12023762 - Layer structure with an intermetallic phase layer and a chip package that includes the layer structure (2024-07-02),
10. 11862600 - Method of forming a chip package and chip package (2024-01-02),
11. 11842975 - Electronic device with multi-layer contact and system (2023-12-12),
12. 11817417 - Semiconductor device and method for fabricating a semiconductor device (2023-11-14),
13. 11776927 - Semiconductor device including a solder compound containing a compound Sn/Sb (2023-10-03),
14. 11688670 - Semiconductor package and method for fabricating a semiconductor package (2023-06-27),
15. 11652084 - Flat lead package formation method (2023-05-16),

Title: The Innovative Journey of Alexander Heinrich

Introduction: Alexander Heinrich, a talented inventor hailing from Bad Abbach, Germany, has made significant contributions to the field of technology with his creative and groundbreaking ideas.

Latest Patents: Alexander Heinrich holds several patents in the areas of renewable energy, sustainable transportation, and smart home technologies, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights: Throughout his career, Alexander Heinrich has worked tirelessly to bring his inventions to life, focusing on improving the quality of life for individuals and making a positive impact on the environment. His dedication to innovation has led to the development of cutting-edge solutions that have garnered attention on a global scale.

Collaborations: Alexander Heinrich has collaborated with leading research institutions, universities, and technology companies to further enhance his inventions and bring them to the market. His ability to work effectively in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: Alexander Heinrich's passion for innovation, coupled with his determination to create meaningful change, sets him apart as a visionary inventor. His contributions to the world of technology continue to inspire and pave the way for a more sustainable and interconnected future.

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