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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12330243 B1

PDFFull Text
Date of Patent:
Jun. 17, 2025

Filed:

Jun. 21, 2024

Method of forming an intermetallic phase layer with a plurality of nickel particles

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Alexander Heinrich, Bad Abbach, DE;

Alexander Roth, Zeitlarn, DE;

Catharina Wille, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
B23K 35/02 (2006.01); B22F 1/052 (2022.01); B23K 35/30 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 35/0244 (2013.01); B22F 1/052 (2022.01); B23K 35/0227 (2013.01); B23K 35/3033 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/49582 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); B22F 2301/15 (2013.01); B22F 2304/10 (2013.01); B23K 2101/40 (2018.08); H01L 2224/2746 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29118 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/29164 (2013.01); H01L 2224/29169 (2013.01);
Abstract

A layer structure includes a first layer including at least one material selected from a first group consisting of nickel, copper, gold, silver, palladium, tin, zinc, platinum, and an alloy of any of these materials; a third layer including at least one material selected from a second group consisting of nickel, copper, gold, palladium, tin, silver, zinc, platinum, and an alloy of any of these materials; and a second layer between the first layer and the third layer. The second layer consists of or essentially consists of nickel and tin. The second layer includes an intermetallic phase of nickel and tin. Methods of forming the layer structure, a chip package and a chip arrangement are also described.

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