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For the Inventor, By the Inventor

Zeitlarn, Germany

Alexander Roth

This inventor holds 20 USPTO granted patents and 13 published patent applications and 11 EPO patents, primarily in Power Semiconductor Technology. Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag. Active years: 2019-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Alexander Roth. Retrieved from https://idiyas.com/inventor/alexander-roth-b3o12gg3

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20 

% Patents Active = 90.0

 

Average Co-Inventor Count = 1.7

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:

goldMedal16 out of 15,027 
 
Infineon Technologies Ag
 patents
silverMedal4 out of 2,201 
 
Infineon Technologies Austria Ag
 patents

Years Active: 2019-2026

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Areas of Expertise:
Power Semiconductor
Thermal Interface Material
Metal-Ceramic Substrate
Intermetallic Phase Layer
Solder Layer
Chip Package
DBC Substrate
Heat-Conducting Layer
Resin-Impregnated Boron Nitride
Leadframe Package
Diffusion Soldering
20 patents (USPTO):Explore Patents
1. 12713920 - POWER SEMICONDUCTOR MODULE ARRANGEMENT COMPRISING HEAT-CONDUCTING LAYER AND HEAT SINK AND METHOD FOR PRODUCING THE SAME (2026-08-18),
2. 12604732 - Power electronics carrier (2026-04-14),
3. 12330243 - Method of forming an intermetallic phase layer with a plurality of nickel particles (2025-06-17),
4. 12237242 - Semiconductor device package comprising a thermal interface material with improved handling properties (2025-02-25),
5. 12119284 - DBC substrate for power semiconductor devices, method for fabricating a DBC substrate and power semiconductor device having a DBC substrate (2024-10-15),
6. 12069802 - Pre-plating of solder layer on solderable elements for diffusion soldering (2024-08-20),
7. 12023762 - Layer structure with an intermetallic phase layer and a chip package that includes the layer structure (2024-07-02),
8. 11804383 - Method for producing a metal-ceramic substrate with electrically conductive vias (2023-10-31),
9. 11626351 - Semiconductor package with barrier to contain thermal interface material (2023-04-11),
10. 11557522 - Method for producing power semiconductor module arrangement (2023-01-17),
11. 11557490 - Method for producing a metal-ceramic substrate with at least one via (2023-01-17),
12. 11552042 - Solder material with two different size nickel particles (2023-01-10),
13. 11404359 - Leadframe package with isolation layer (2022-08-02),
14. 11155739 - Resin-impregnated boron nitride body and a method for producing a resin-impregnated boron nitride body (2021-10-26),
15. 11081414 - Power semiconductor module arrangement (2021-08-03),

Title: The Innovative Journey of Alexander Roth

Introduction: Alexander Roth, a visionary inventor hailing from Zeitlarn, Germany, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Alexander Roth's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, and a sustainable energy solution that aims to reduce carbon emissions.

Career Highlights: Throughout his illustrious career, Alexander Roth has been recognized for his innovative spirit and dedication to creating solutions that improve people's lives. His inventions have garnered international acclaim and have been instrumental in shaping the future of technology.

Collaborations: Alexander Roth has collaborated with leading tech companies and research institutions to bring his inventions to life. His ability to work seamlessly with teams of experts has led to the successful development and implementation of his groundbreaking ideas.

Conclusion: Alexander Roth's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a pioneering inventor in the tech industry. His contributions continue to inspire future generations of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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