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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11552042 B1

PDFFull Text
Date of Patent:
Jan. 10, 2023

Filed:

Dec. 10, 2020

Solder material with two different size nickel particles

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Alexander Heinrich, Bad Abbach, DE;

Alexander Roth, Zeitlarn, DE;

Catharina Wille, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/00 (2006.01); H01L 23/00 (2006.01); B23K 35/30 (2006.01); B23K 35/02 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); B22F 1/052 (2022.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); B22F 1/052 (2022.01); B23K 35/0227 (2013.01); B23K 35/0244 (2013.01); B23K 35/3033 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/49582 (2013.01); H01L 24/27 (2013.01); B22F 2301/15 (2013.01); B22F 2304/10 (2013.01); B23K 2101/40 (2018.08); H01L 2224/2746 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29118 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/29164 (2013.01); H01L 2224/29169 (2013.01);
Abstract

A solder material may include nickel and tin. The nickel may include first and second amounts of particles. A sum of the particle amounts is a total amount of nickel or less. The first amount is between 5 at % and 60 at % of the total amount of nickel. The second amount is between 10 at % and 95 at % of the total amount of nickel. The particles of the first amount have a first size distribution, the particles of the second amount have a second size distribution, 30% to 70% of the first amount have a particle size in a range of about 5 μm around a particle size the highest number of particles have according to the first size distribution, and 30% to 70% of the second amount have a particle size in a range of about 5 μm around a particle size the highest number of particles have according to the second size distribution.

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