The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Jul. 06, 2021
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Martin Mayer, Nittendorf, DE;
Edward Fuergut, Dasing, DE;
Alexander Roth, Zeitlarn, DE;
Karina Rott, Munich, DE;
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/42 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/42 (2013.01); H01L 23/3121 (2013.01); H01L 23/3735 (2013.01); H01L 23/3736 (2013.01);
Abstract
A semiconductor device package comprises an electrically conductive carrier, a semiconductor die disposed on the carrier, an encapsulant encapsulating part of the carrier and the semiconductor die, an electrically insulating and thermally conductive interface structure, in particular covering an exposed surface portion of the carrier and a connected surface portion of the encapsulant, wherein the interface structure comprises a glass transition temperature in a range between −40° C. to 150° C.