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For the Inventor, By the Inventor

Dasing, Germany

Edward Fuergut

USPTO Granted Patents = 139 

 

Average Co-Inventor Count = 3.3

ph-index = 14

Forward Citations = 765(Granted Patents)


Inventors with similar research interests:


Location History:

  • Ligusterweg, DE (2010)
  • Dasing, DE (2006 - 2024)

Company Filing History:

goldMedal110 out of 14,705 
 
Infineon Technologies Ag
 patents
silverMedal25 out of 2,093 
 
Infineon Technologies Austria Ag
 patents
bronzeMedal3 out of 511 
 
Intel Mobile Communications Gmbh
 patents
4. 1 out of 832,680 
Other
 patents

Years Active: 2006-2025

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139 patents (USPTO):
1. 12463116 - Method for fabricating a semiconductor device including an embedded semiconductor die (2025-11-04),
2. 12438063 - Electronic module including a semiconductor package disposed on an interposer layer (2025-10-07),
3. 12324186 - Power semiconductor device and method (2025-06-03),
4. 12261146 - Semiconductor package (2025-03-25),
5. 12237242 - Semiconductor device package comprising a thermal interface material with improved handling properties (2025-02-25),
6. 12218030 - Electronic module comprising a semiconductor package with integrated clip and fastening element (2025-02-04),
7. 12218029 - Semiconductor device with improved performance in operation and improved flexibility in the arrangement of power chips (2025-02-04),
8. 12136623 - Multi-device semiconductor chip with electrical access to devices at either side (2024-11-05),
9. 12125772 - Method of forming a semiconductor package with connection lug (2024-10-22),
10. 12094793 - Package with electrically insulated carrier and at least one step on encapsulant (2024-09-17),
11. 12080669 - Semiconductor device module having vertical metallic contacts and a method for fabricating the same (2024-09-03),
12. 12002739 - Semiconductor device including an embedded semiconductor die (2024-06-04),
13. 11984392 - Semiconductor package having a chip carrier with a pad offset feature (2024-05-14),
14. 11955407 - Electronic module including a semiconductor package connected to a fluid heatsink (2024-04-09),
15. 11942383 - Linear spacer for spacing a carrier of a package (2024-03-26),

Title: Biography of Edward Fuergut

Introduction

Edward Fuergut is a prominent inventor based in Dasing, Germany. He holds an impressive portfolio of 137 patents, showcasing his significant contributions to the field of semiconductor technology. His innovative work has made a lasting impact on the industry.

Latest Patents

Among his latest patents is a power semiconductor device and method. This device features a semiconductor body with a front side surface and a first passivation layer made of polycrystalline diamond. Another notable patent is for a semiconductor package that includes at least one semiconductor chip with a contact pad designed to conduct current, along with a conductor element and electrically conductive spacers.

Career Highlights

Edward has had a successful career, working with leading companies in the semiconductor industry. He has been associated with Infineon Technologies AG and Infineon Technologies Austria AG, where he has contributed to various innovative projects.

Collaborations

Throughout his career, Edward has collaborated with notable colleagues, including Joachim Mahler and Martin Gruber. These partnerships have further enhanced his work and contributions to the field.

Conclusion

Edward Fuergut's dedication to innovation in semiconductor technology is evident through his numerous patents and collaborations. His work continues to influence the industry, making him a respected figure among inventors.

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