The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2025

Filed:

May. 25, 2022
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Edward Fuergut, Dasing, DE;

Anton Mauder, Kolbermoor, DE;

Stephan Voss, Munich, DE;

Martin Gruber, Schwandorf, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/06 (2006.01); H01L 23/00 (2006.01); H01L 23/10 (2006.01); H01L 23/373 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 24/48 (2013.01); H01L 25/072 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48225 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A device includes an interposer including an insulative layer between a lower metal layer and a first upper metal layer and a second upper metal layer, a semiconductor transistor die attached to the first upper metal layer and comprising a first lower main face and a second upper main face, with a drain or collector pad on the first main face and electrically connected to the first upper metal layer, a source or emitter electrode pad and a gate electrode pad on the second main face, a leadframe connected to the interposer and comprising a first lead connected with the first upper metal layer, a second lead connected with the source electrode pad, and a third lead connected with the second upper metal layer, and wherein an electrical connector that is connected between the gate electrode pad and the second upper metal layer is orthogonal to a first electrical connector.


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