Martin Gruber

This inventor holds 52 USPTO granted patents and 6 published patent applications and 5 EPO patents, primarily in Semiconductor Packaging. Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag. Active years: 2002-2026.

USPTO Granted Patents = 52 (Patent Applications = 6)

% Patents Active = 90.4

EPO Patents = 5 (Patent Applications = 12)

Average Co-Inventor Count = 4.0

ph-index = 3

Forward Citations = 47(Granted Patents)

Company Filing History:

30 out of 15,016

Infineon Technologies Ag

patents

22 out of 2,195

Infineon Technologies Austria Ag

patents

Years Active: 2002-2026

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Areas of Expertise:

Semiconductor Die Package

Electronic Module

Lead Frame

Clip Frame

Embedded Semiconductor Die

Power Chips

Thermal Management

Electrical Redistribution Layers

Drilling Screw

Silicon Carbide Device

Multi-Functional Interconnect

Magnetic Current Sensor

52 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12707957 - Silicon carbide device and method for forming a silicon carbide device (2026-08-11),

2. 12604752 - Semiconductor die package (2026-04-14),

3. 12575429 - Semiconductor package having a lead frame and a clip frame (2026-03-10),

4. 12463116 - Method for fabricating a semiconductor device including an embedded semiconductor die (2025-11-04),

5. 12438063 - Electronic module including a semiconductor package disposed on an interposer layer (2025-10-07),

6. 12394697 - Method for fabricating a semiconductor device package comprising a pin in the form of a drilling screw (2025-08-19),

7. 12374640 - Device for controlling trapped ions (2025-07-29),

8. 12261146 - Semiconductor package (2025-03-25),

9. 12218030 - Electronic module comprising a semiconductor package with integrated clip and fastening element (2025-02-04),

10. 12218029 - Semiconductor device with improved performance in operation and improved flexibility in the arrangement of power chips (2025-02-04),

11. 12165959 - Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method (2024-12-10),

12. 12154886 - Semiconductor packages including electrical redistribution layers of different thicknesses and methods for manufacturing thereof (2024-11-26),

13. 12125772 - Method of forming a semiconductor package with connection lug (2024-10-22),

14. 12080669 - Semiconductor device module having vertical metallic contacts and a method for fabricating the same (2024-09-03),

15. 12002739 - Semiconductor device including an embedded semiconductor die (2024-06-04),

Title: The Innovative Mind of Martin Gruber

Introduction: Martin Gruber, a distinguished inventor hailing from Schwandorf, Germany, is renowned for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Martin Gruber holds several patents in the areas of renewable energy, sustainable transportation, and advanced robotics, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Martin Gruber has worked with leading research institutions and tech companies, consistently pushing the boundaries of what is possible in the realm of technology. His innovative solutions have revolutionized industries and improved the lives of many.

Collaborations: Throughout his career, Martin Gruber has collaborated with top engineers, scientists, and designers from around the world, fostering a culture of creativity and excellence in all his projects. His ability to work effectively in multidisciplinary teams has been key to his success.

Conclusion: In conclusion, Martin Gruber stands as a beacon of innovation in the field of technology, with a legacy that continues to inspire future generations of inventors and creators. His relentless pursuit of excellence and passion for pushing the boundaries of what is possible make him a true pioneer in the world of inventions.