The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
Sep. 23, 2021
Infineon Technologies Austria Ag, Villach, AT;
Edward Fuergut, Dasing, DE;
Martin Gruber, Schwandorf, DE;
Petteri Palm, Stein, DE;
Bernd Schmoelzer, Radenthein, AT;
Wolfgang Scholz, Olching, DE;
Mark Thomas, Bodensdorf, AT;
Infineon Technologies Austria AG, Villach, AT;
Abstract
A semiconductor device module includes a package carrier having an opening, wherein in the opening there is disposed a semiconductor package including a semiconductor die, an encapsulant, and first vertical contacts, wherein the encapsulant at least partially covers the semiconductor die, and the first vertical contacts are connected to the semiconductor die and extend at least partially through the encapsulant, and a first outer metallic contact layer electrically connected to the first vertical contacts.