Olching, Germany

Wolfgang Scholz

This inventor holds 15 USPTO granted patents and 9 published patent applications and 1 EPO patent, primarily in Semiconductor Devices. Top assignees: Infineon Technologies Austria Ag, Infineon Technologies Ag, Infineon Technologies Dresden Gmbh. Active years: 2012-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wolfgang Scholz. Retrieved from https://idiyas.com/inventor/wolfgang-scholz-jekn0eci

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 15 

% Patents Active = 46.7

 

Average Co-Inventor Count = 4.9

ph-index = 2

Forward Citations = 19(Granted Patents)


Company Filing History:


Years Active: 2012-2026

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Areas of Expertise:
Semiconductor Package
Silicon Carbide Device
Embedded Package
Delamination Mitigation
Vertical Metallic Contacts
Temperature Protection
Die Pads
Control Circuit
Insulated Gate Bipolar Transistor
Electronic Device
Component Arrangement
15 patents (USPTO):Explore Patents

Title: Wolfgang Scholz: Innovator in Semiconductor Technology

Introduction

Wolfgang Scholz is a prominent inventor based in Olching, Germany, known for his significant contributions to semiconductor technology. With a total of 11 patents to his name, Scholz has made remarkable advancements in the field, particularly in the design and fabrication of semiconductor devices.

Latest Patents

Among his latest patents, one notable invention is a semiconductor device module featuring vertical metallic contacts and a method for fabricating the same. This innovative module includes a package carrier with an opening that houses a semiconductor package, which consists of a semiconductor die, an encapsulant, and first vertical contacts. The encapsulant partially covers the semiconductor die, while the first vertical contacts connect to the die and extend through the encapsulant, culminating in an outer metallic contact layer. Another significant patent involves a semiconductor device that includes an embedded semiconductor die. This device features a die carrier with a semiconductor die on its main face, covered by an encapsulant and an insulation layer, along with electrical interconnects linked to the contact pads of the semiconductor die.

Career Highlights

Wolfgang Scholz has had a distinguished career, working with leading companies in the semiconductor industry. He has been associated with Infineon Technologies Austria AG and Infineon Technologies AG, where he has contributed to various innovative projects and developments in semiconductor technology.

Collaborations

Throughout his career, Scholz has collaborated with notable colleagues, including Anton Mauder and Hans-Joachim Schulze. These collaborations have further enriched his work and contributed to the advancement of semiconductor technologies.

Conclusion

Wolfgang Scholz's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of advanced semiconductor devices, showcasing the importance of innovation in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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