The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2024
Filed:
Feb. 11, 2021
Infineon Technologies Austria Ag, Villach, AT;
Edward Fuergut, Dasing, DE;
Achim Althaus, Regensburg, DE;
Martin Gruber, Schwandorf, DE;
Marco Nicolas Mueller, Villach, AT;
Bernd Schmoelzer, Radenthein, AT;
Wolfgang Scholz, Olching, DE;
Mark Thomas, Bodensdorf, AT;
Infineon Technologies Austria AG, Villach, AT;
Abstract
A semiconductor device includes a die carrier, a semiconductor die disposed on a main face of the die carrier, the semiconductor die including one or more contact pads, an encapsulant covering at least partially the semiconductor die and at least a portion of the main face of the die carrier, an insulation layer covering the encapsulant, and one or more electrical interconnects, each being connected with one of the one or more contact pads of the semiconductor die and extending through the encapsulant.