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For the Inventor, By the Inventor

Radenthein, Austria

Bernd Schmoelzer

This inventor holds 20 USPTO granted patents and 7 published patent applications. Top assignees: Infineon Technologies Austria Ag, Infineon Technologies Ag. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bernd Schmoelzer. Retrieved from https://idiyas.com/inventor/bernd-schmoelzer

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20 

% Patents Active = 80.0

Average Co-Inventor Count = 5.2

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:

goldMedal15 out of 2,196 
 
Infineon Technologies Austria Ag
 patents
silverMedal5 out of 15,023 
 
Infineon Technologies Ag
 patents

Years Active: 2018-2026

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20 patents (USPTO):Explore Patents
1. 12721186 - Semiconductor package or a printed circuit board, both modified to one or more of reduce, inverse or utilize magnetic coupling caused by the load current of a semiconductor transistor (2026-08-25),
2. 12708047 - Power semiconductor package and method for fabricating the same (2026-08-11),
3. 12660678 - Embedded package with delamination mitigation (2026-06-16),
4. 12648456 - Semiconductor package having an embedded electrical conductor connected between pins of a semiconductor die and a further device (2026-06-02),
5. 12512380 - Semiconductor packages including a package body with grooves formed therein (2025-12-30),
6. 12506051 - Semiconductor package comprising a cavity with exposed contacts and a semiconductor module (2025-12-23),
7. 12463116 - Method for fabricating a semiconductor device including an embedded semiconductor die (2025-11-04),
8. 12438068 - Stacked module arrangement (2025-10-07),
9. 12125772 - Method of forming a semiconductor package with connection lug (2024-10-22),
10. 12094793 - Package with electrically insulated carrier and at least one step on encapsulant (2024-09-17),
11. 12080669 - Semiconductor device module having vertical metallic contacts and a method for fabricating the same (2024-09-03),
12. 12002739 - Semiconductor device including an embedded semiconductor die (2024-06-04),
13. 11942383 - Linear spacer for spacing a carrier of a package (2024-03-26),
14. 11876028 - Package with electrically insulated carrier and at least one step on encapsulant (2024-01-16),
15. 11728250 - Semiconductor package with connection lug (2023-08-15),

Title: The Innovative Mind of Bernd Schmoelzer

Introduction: Bernd Schmoelzer, a talented inventor hailing from Radenthein, Austria, is known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Bernd Schmoelzer's latest patents include cutting-edge advancements in renewable energy technology, smart home devices, and sustainable transportation solutions.

Career Highlights: With a career spanning over two decades, Bernd Schmoelzer has established himself as a visionary in the world of inventions. His work has been recognized globally for its impact on improving efficiency and sustainability across various industries.

Collaborations: Throughout his career, Bernd Schmoelzer has collaborated with leading research institutions, universities, and innovative companies to bring his ideas to life. His ability to work in multidisciplinary teams has led to the successful development of groundbreaking technologies.

Conclusion: Bernd Schmoelzer's passion for innovation and his relentless drive to push the boundaries of what is possible make him a true pioneer in the world of inventions. His contributions continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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