The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2026
Filed:
May. 09, 2023
Infineon Technologies Ag, Neubiberg, DE;
Lee Shuang Wang, Bukit Baru, MY;
Marta Alomar Dominguez, Nötsch im Gailtal, AT;
Marcus Böhm, Mintraching, DE;
Edward Fürgut, Dasing, DE;
Chii Shang Hong, Bukit Katil, MY;
Teck Sim Lee, Melaka, MY;
Bernd Schmoelzer, Radenthein, AT;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor package is disclosed. In one example, the semiconductor package comprises a package body and a second die pad at least partially encapsulated in the package body. A first semiconductor die is at least partially encapsulated in the package body and arranged on the first die pad. A further device at least partially encapsulated in the package body and arranged on the second die pad. At least one first lead is connected with the first contact pad of the first semiconductor die. At least one second lead is connected with the second contact pad of the further device. An electrical conductor is connected between the at least one first lead and the at least one second lead, the electrical conductor being completely encapsulated in the package body.