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For the Inventor, By the Inventor

Malacca, Malaysia

Teck Sim Lee

This inventor holds 33 USPTO granted patents and 12 published patent applications and 3 EPO patents, primarily in Semiconductor Packaging. Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag. Active years: 2010-2026.

USPTO Granted Patents = 33 

% Patents Active = 87.9

 

Average Co-Inventor Count = 5.0

ph-index = 4

Forward Citations = 50(Granted Patents)


Location History:

  • Malacca, MY (2010 - 2014)
  • Melaka, MY (2010 - 2024)

Company Filing History:

goldMedal18 out of 15,023 
 
Infineon Technologies Ag
 patents
silverMedal15 out of 2,196 
 
Infineon Technologies Austria Ag
 patents

Years Active: 2010-2026

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Areas of Expertise:
Power Semiconductor Package
Multi-Chip Package
Thermal Performance
Electrical Conductor
Lead Frame Design
Cooling Surface
Encapsulant
Connection Methods
Protruding Component
Fabrication Method
Device Packaging
Heat Spreader
33 patents (USPTO):Explore Patents
1. 12707989 - Power semiconductor package and method for fabricating the same (2026-08-11),
2. 12648456 - Semiconductor package having an embedded electrical conductor connected between pins of a semiconductor die and a further device (2026-06-02),
3. 12094793 - Package with electrically insulated carrier and at least one step on encapsulant (2024-09-17),
4. 11942383 - Linear spacer for spacing a carrier of a package (2024-03-26),
5. 11876028 - Package with electrically insulated carrier and at least one step on encapsulant (2024-01-16),
6. 11804424 - Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip (2023-10-31),
7. 11676881 - Semiconductor package, semiconductor assembly and method for fabricating a semiconductor package (2023-06-13),
8. 11600547 - Semiconductor package with expanded heat spreader (2023-03-07),
9. 11355424 - Multi-chip package (2022-06-07),
10. 11348866 - Package and lead frame design for enhanced creepage and clearance (2022-05-31),
11. 10727151 - Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package (2020-07-28),
12. 10699978 - SMD package with top side cooling (2020-06-30),
13. 10373897 - Semiconductor devices with improved thermal and electrical performance (2019-08-06),
14. 10290567 - Transistor package with three-terminal clip (2019-05-14),
15. 10204845 - Semiconductor chip package having a repeating footprint pattern (2019-02-12),

Title: The Innovative Journey of Teck Sim Lee

Introduction:

Teck Sim Lee, a pioneering inventor hailing from Melaka, Malaysia, has made significant contributions to the field of technology and innovation.

Latest Patents:

Teck Sim Lee's latest patents include groundbreaking inventions in the realm of renewable energy technologies and sustainable materials.

Career Highlights:

Throughout his illustrious career, Teck Sim Lee has been at the forefront of developing cutting-edge solutions for environmental challenges. His work has garnered international recognition and praise.

Collaborations:

Teck Sim Lee has collaborated with leading research institutions and universities worldwide to further advance his innovative ideas. His partnerships have led to the creation of impactful inventions that have the potential to shape the future.

Conclusion:

In conclusion, Teck Sim Lee's dedication to innovation and his relentless pursuit of technological advancement have solidified his position as a trailblazing inventor in the global landscape of inventions.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
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