IDiyas

For the Inventor, By the Inventor

Melaka, Malaysia

Teck Sim Lee

USPTO Granted Patents = 31 

 

Average Co-Inventor Count = 5.0

ph-index = 4

Forward Citations = 45(Granted Patents)


Location History:

  • Malacca, MY (2010 - 2014)
  • Melaka, MY (2010 - 2024)

Company Filing History:

goldMedal17 out of 14,705 
 
Infineon Technologies Ag
 patents
silverMedal14 out of 2,093 
 
Infineon Technologies Austria Ag
 patents

Years Active: 2010-2024

where 'Filed Patents' based on already Granted Patents

31 patents (USPTO):
1. 12094793 - Package with electrically insulated carrier and at least one step on encapsulant (2024-09-17),
2. 11942383 - Linear spacer for spacing a carrier of a package (2024-03-26),
3. 11876028 - Package with electrically insulated carrier and at least one step on encapsulant (2024-01-16),
4. 11804424 - Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip (2023-10-31),
5. 11676881 - Semiconductor package, semiconductor assembly and method for fabricating a semiconductor package (2023-06-13),
6. 11600547 - Semiconductor package with expanded heat spreader (2023-03-07),
7. 11355424 - Multi-chip package (2022-06-07),
8. 11348866 - Package and lead frame design for enhanced creepage and clearance (2022-05-31),
9. 10727151 - Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package (2020-07-28),
10. 10699978 - SMD package with top side cooling (2020-06-30),
11. 10373897 - Semiconductor devices with improved thermal and electrical performance (2019-08-06),
12. 10290567 - Transistor package with three-terminal clip (2019-05-14),
13. 10204845 - Semiconductor chip package having a repeating footprint pattern (2019-02-12),
14. 10147703 - Semiconductor package for multiphase circuitry device (2018-12-04),
15. 10083899 - Semiconductor package with heat slug and rivet free die attach area (2018-09-25),

Title: The Innovative Journey of Teck Sim Lee

Introduction:

Teck Sim Lee, a pioneering inventor hailing from Melaka, Malaysia, has made significant contributions to the field of technology and innovation.

Latest Patents:

Teck Sim Lee's latest patents include groundbreaking inventions in the realm of renewable energy technologies and sustainable materials.

Career Highlights:

Throughout his illustrious career, Teck Sim Lee has been at the forefront of developing cutting-edge solutions for environmental challenges. His work has garnered international recognition and praise.

Collaborations:

Teck Sim Lee has collaborated with leading research institutions and universities worldwide to further advance his innovative ideas. His partnerships have led to the creation of impactful inventions that have the potential to shape the future.

Conclusion:

In conclusion, Teck Sim Lee's dedication to innovation and his relentless pursuit of technological advancement have solidified his position as a trailblazing inventor in the global landscape of inventions.

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