Teck Sim Lee

This inventor holds 33 USPTO granted patents and 12 published patent applications and 3 EPO patents. Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag. Active years: 2010-2026.

USPTO Granted Patents = 33 (Patent Applications = 12)

% Patents Active = 87.9

EPO Patents = 3 (Patent Applications = 3)

Average Co-Inventor Count = 5.0

ph-index = 4

Forward Citations = 50(Granted Patents)

Location History:

Malacca, MY (2010 - 2014)
Melaka, MY (2010 - 2024)

Company Filing History:

18 out of 15,005

Infineon Technologies Ag

patents

15 out of 2,194

Infineon Technologies Austria Ag

patents

Years Active: 2010-2026

Loading Chart...

Areas of Expertise:

Semiconductor Package

Multi-Chip Package

Thermal Performance

Cooling Surface

Lead Frame Design

Power Semiconductor Device

Encapsulant Technology

Electronic Device Fabrication

Functionalized Interface Structure

Heat Spreader

Transistor Package

Creepage and Clearance

33 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12707989 - Power semiconductor package and method for fabricating the same (2026-08-11),

2. 12648456 - Semiconductor package having an embedded electrical conductor connected between pins of a semiconductor die and a further device (2026-06-02),

3. 12094793 - Package with electrically insulated carrier and at least one step on encapsulant (2024-09-17),

4. 11942383 - Linear spacer for spacing a carrier of a package (2024-03-26),

5. 11876028 - Package with electrically insulated carrier and at least one step on encapsulant (2024-01-16),

6. 11804424 - Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip (2023-10-31),

7. 11676881 - Semiconductor package, semiconductor assembly and method for fabricating a semiconductor package (2023-06-13),

8. 11600547 - Semiconductor package with expanded heat spreader (2023-03-07),

9. 11355424 - Multi-chip package (2022-06-07),

10. 11348866 - Package and lead frame design for enhanced creepage and clearance (2022-05-31),

11. 10727151 - Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package (2020-07-28),

12. 10699978 - SMD package with top side cooling (2020-06-30),

13. 10373897 - Semiconductor devices with improved thermal and electrical performance (2019-08-06),

14. 10290567 - Transistor package with three-terminal clip (2019-05-14),

15. 10204845 - Semiconductor chip package having a repeating footprint pattern (2019-02-12),

Title: The Innovative Journey of Teck Sim Lee

Introduction:

Teck Sim Lee, a pioneering inventor hailing from Melaka, Malaysia, has made significant contributions to the field of technology and innovation.

Latest Patents:

Teck Sim Lee's latest patents include groundbreaking inventions in the realm of renewable energy technologies and sustainable materials.

Career Highlights:

Throughout his illustrious career, Teck Sim Lee has been at the forefront of developing cutting-edge solutions for environmental challenges. His work has garnered international recognition and praise.

Collaborations:

Teck Sim Lee has collaborated with leading research institutions and universities worldwide to further advance his innovative ideas. His partnerships have led to the creation of impactful inventions that have the potential to shape the future.

Conclusion:

In conclusion, Teck Sim Lee's dedication to innovation and his relentless pursuit of technological advancement have solidified his position as a trailblazing inventor in the global landscape of inventions.