The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2023
Filed:
Jul. 15, 2020
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Ralf Otremba, Kaufbeuren, DE;
Teck Sim Lee, Melaka, MY;
Klaus Schiess, Allensbach, DE;
Xaver Schloegel, Sachsenkam, DE;
Lee Shuang Wang, Melaka, MY;
Mohd Hasrul Zulkifli, Selangor, MY;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/12 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3677 (2013.01); H01L 21/4871 (2013.01); H01L 23/12 (2013.01); H01L 23/3107 (2013.01);
Abstract
A semiconductor package is disclosed. In one example, the semiconductor package includes a chip carrier, a semiconductor chip attached to the chip carrier, an encapsulation body encapsulating the semiconductor chip, and a mounting hole configured to receive a screw for screw mounting a heatsink onto a first side of the semiconductor package. A second side of the semiconductor package opposite the first side is configured to be surface mounted to an application board.