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For the Inventor, By the Inventor

Sachsenkam, Germany

Xaver Schloegel

This inventor holds 59 USPTO granted patents and 6 published patent applications and 1 EPO patent, primarily in Power Semiconductor Systems (CPC class H01L). Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag, Siemens Aktiengesellschaft. Active years: 1998-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xaver Schloegel. Retrieved from https://idiyas.com/inventor/xaver-schloegel

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 59 

% Patents Active = 81.4

 

Average Co-Inventor Count = 4.5

ph-index = 8

Forward Citations = 211(Granted Patents)

Forward Citations (Not Self Cited) = 201(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Sachsenkamm, DE (2010)
  • Sachsenskam, DE (2009 - 2012)
  • Sachsenkarm, DE (2012 - 2014)
  • Sachsenkam, DE (1998 - 2024)

Company Filing History:

goldMedal39 out of 15,040 
 
Infineon Technologies Ag
 patents
silverMedal18 out of 2,211 
 
Infineon Technologies Austria Ag
 patents
bronzeMedal1 out of 30,893 
 
Siemens Aktiengesellschaft
 patents
4. 1 out of 1 
 
Tinfineon Technologies Austria Ag
 patent

Years Active: 1998-2024

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Areas of Expertise:
Power Semiconductor
SMD Package
Inductor Module
Semiconductor Assembly
Chip Carrier
Heat Sink
Multi-Chip Device
Electronic Device
Transistor Arrangement
Manufacturing Method
Chip Arrangement
Semiconductor Housing
59 patents (USPTO):Explore Patents
1. 11996771 - Power semiconductor system having an inductor module attached to a power stage module (2024-05-28),
2. 11676881 - Semiconductor package, semiconductor assembly and method for fabricating a semiconductor package (2023-06-13),
3. 11539291 - Method of manufacturing a power semiconductor system (2022-12-27),
4. 10903133 - Method of producing an SMD package with top side cooling (2021-01-26),
5. 10886186 - Semiconductor package system (2021-01-05),
6. 10833583 - Methods of manufacturing inductor modules and power semiconductor systems having inductor modules (2020-11-10),
7. 10700037 - Reinforcement for electrical connectors (2020-06-30),
8. 10699987 - SMD package with flat contacts to prevent bottleneck (2020-06-30),
9. 10699978 - SMD package with top side cooling (2020-06-30),
10. 10601314 - Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modules (2020-03-24),
11. 10566260 - SMD package with top side cooling (2020-02-18),
12. 10204845 - Semiconductor chip package having a repeating footprint pattern (2019-02-12),
13. 9991183 - Semiconductor component having inner and outer semiconductor component housings (2018-06-05),
14. 9978671 - Power semiconductor device (2018-05-22),
15. 9824958 - Chip carrier structure, chip package and method of manufacturing the same (2017-11-21),

Title: The Innovative Mind of Xaver Schloegel

Introduction: Xaver Schloegel, a visionary inventor hailing from Sachsenkam, Germany, is renowned for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Xaver Schloegel's recent patents include cutting-edge advancements in renewable energy systems, smart home technology, and sustainable transportation solutions.

Career Highlights: With a career spanning over two decades, Xaver Schloegel has established himself as a leading figure in the world of inventors. His innovative spirit and dedication to pushing the boundaries of technology have led to numerous successful patents and inventions.

Collaborations: Throughout his career, Xaver Schloegel has collaborated with top research institutions, universities, and leading companies to bring his ideas to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: Xaver Schloegel's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors. His impact on the world of technology is undeniable, and his legacy will undoubtedly endure for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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