The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2020

Filed:

Nov. 13, 2017
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Eung San Cho, Torrance, CA (US);

Thorsten Meyer, Regensburg, DE;

Xaver Schloegel, Sachsenkam, DE;

Thomas Behrens, Wenzenbach, DE;

Josef Hoeglauer, Heimstetten, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01L 23/49844 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 24/43 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 24/13 (2013.01); H01L 24/45 (2013.01); H01L 24/81 (2013.01); H01L 2224/11825 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/43825 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/4801 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/48992 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8192 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01079 (2013.01);
Abstract

In some examples, a device includes a semiconductor element, a layer element, and a single connector element electrically connecting the semiconductor element and the layer element. In some examples, the single connector element includes two or more discrete connector elements, and each discrete connector element of the two or more discrete connector elements electrically connects the semiconductor element and the layer element. In some examples, the single connector element also includes conductive material attached to the two or more discrete connector elements.


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