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For the Inventor, By the Inventor

Heimstetten, Germany

Josef Hoeglauer

USPTO Granted Patents = 79 

 

Average Co-Inventor Count = 4.3

ph-index = 8

Forward Citations = 276(Granted Patents)

DiyaCoin DiyaCoin = 0.37 


Inventors with similar research interests:


Location History:

  • Munich, DE (2009 - 2015)
  • Kirchheim-Heimstetten, DE (2013 - 2015)
  • Kirchhein-Heimstetten, DE (2014 - 2015)
  • Kirchheim-Heimstette, DE (2016)
  • Helmstetten, DE (2013 - 2017)
  • Haimstetten, DE (2017)
  • Heimstetten, DE (2014 - 2024)

Company Filing History:

goldMedal49 out of 14,705 
 
Infineon Technologies Ag
 patents
silverMedal27 out of 2,093 
 
Infineon Technologies Austria Ag
 patents
bronzeMedal1 out of 555 
 
Qimonda Ag
 patents
4. 1 out of 1 
 
Infineon Technoloiges Austria Ag
 patent
5. 1 out of 1 
 
Tinfineon Technologies Austria Ag
 patent

Years Active: 2009-2025

where 'Filed Patents' based on already Granted Patents

79 patents (USPTO):
1. 12237246 - Semiconductor devices including parallel electrically conductive layers (2025-02-25),
2. 12218038 - Leadframe, semiconductor package and method (2025-02-04),
3. 12205919 - Method of processing a semiconductor wafer, semiconductor die, and method of producing a semiconductor module (2025-01-21),
4. 12087740 - Method of forming a semiconductor module (2024-09-10),
5. 12027436 - Package with clip having through hole accommodating component-related structure (2024-07-02),
6. 11996771 - Power semiconductor system having an inductor module attached to a power stage module (2024-05-28),
7. 11978692 - Semiconductor package, semiconductor module and methods for manufacturing a semiconductor package and a semiconductor module (2024-05-07),
8. 11817430 - Semiconductor module (2023-11-14),
9. 11776882 - Method of fabricating a semiconductor package (2023-10-03),
10. 11539291 - Method of manufacturing a power semiconductor system (2022-12-27),
11. 11515244 - Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture (2022-11-29),
12. 11302610 - Semiconductor package and method of fabricating a semiconductor package (2022-04-12),
13. 10964628 - Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture (2021-03-30),
14. 10903133 - Method of producing an SMD package with top side cooling (2021-01-26),
15. 10833583 - Methods of manufacturing inductor modules and power semiconductor systems having inductor modules (2020-11-10),

Title: The Innovative Journey of Inventor Josef Hoeglauer

Introduction: Josef Hoeglauer, a talented inventor hailing from Heimstetten, Germany, has made significant contributions to the field of innovations with his creative mind and dedication to problem-solving.

Latest Patents: Josef Hoeglauer's latest patents showcase his commitment to pushing the boundaries of technology and improving everyday life for people around the world. His recent inventions focus on sustainability and efficiency in various industries.

Career Highlights: Throughout his illustrious career, Josef Hoeglauer has been recognized for his groundbreaking inventions that have revolutionized the way we live and work. His innovative spirit and attention to detail have led to numerous successful patents in diverse fields.

Collaborations: Josef Hoeglauer has collaborated with leading companies, research institutions, and universities to bring his inventions to life. His partnerships have been instrumental in turning his visionary ideas into tangible products that have a positive impact on society.

Conclusion: In conclusion, Josef Hoeglauer's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of inventors. His remarkable contributions continue to inspire future generations to think outside the box and create solutions that shape a better tomorrow.

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