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For the Inventor, By the Inventor

Heimstetten, Germany

Josef Hoeglauer

This inventor holds 81 USPTO granted patents and 13 published patent applications and 4 EPO patents, primarily in Semiconductor Packaging (CPC class H01L23-49562). Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag, Qimonda Ag. Active years: 2009-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Josef Hoeglauer. Retrieved from https://idiyas.com/inventor/josef-hoeglauer

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 81 

% Patents Active = 84.0

 

Average Co-Inventor Count = 4.3

ph-index = 8

Forward Citations = 281(Granted Patents)

Forward Citations (Not Self Cited) = 262(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Munich, DE (2009 - 2015)
  • Kirchheim-Heimstetten, DE (2013 - 2015)
  • Kirchhein-Heimstetten, DE (2014 - 2015)
  • Kirchheim-Heimstette, DE (2016)
  • Helmstetten, DE (2013 - 2017)
  • Haimstetten, DE (2017)
  • Heimstetten, DE (2014 - 2024)

Company Filing History:

goldMedal50 out of 15,023 
 
Infineon Technologies Ag
 patents
silverMedal29 out of 2,196 
 
Infineon Technologies Austria Ag
 patents
bronzeMedal1 out of 555 
 
Qimonda Ag
 patents
4. 1 out of 1 
 
Tinfineon Technologies Austria Ag
 patent

Years Active: 2009-2026

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Areas of Expertise:
Semiconductor Package
Power Semiconductor System
SMD Package
Clip Frame Assembly
Inductor Module
Chip Arrangement
Transistor Arrangement
Heat Sink
Integrated Circuits
Electrical Connectors
Multi-Chip Device
Wafer Processing
81 patents (USPTO):Explore Patents
1. 12575429 - Semiconductor package having a lead frame and a clip frame (2026-03-10),
2. 12519042 - Methods for manufacturing a semiconductor package and a semiconductor module (2026-01-06),
3. 12237246 - Semiconductor devices including parallel electrically conductive layers (2025-02-25),
4. 12218038 - Leadframe, semiconductor package and method (2025-02-04),
5. 12205919 - Method of processing a semiconductor wafer, semiconductor die, and method of producing a semiconductor module (2025-01-21),
6. 12087740 - Method of forming a semiconductor module (2024-09-10),
7. 12027436 - Package with clip having through hole accommodating component-related structure (2024-07-02),
8. 11996771 - Power semiconductor system having an inductor module attached to a power stage module (2024-05-28),
9. 11978692 - Semiconductor package, semiconductor module and methods for manufacturing a semiconductor package and a semiconductor module (2024-05-07),
10. 11817430 - Semiconductor module (2023-11-14),
11. 11776882 - Method of fabricating a semiconductor package (2023-10-03),
12. 11539291 - Method of manufacturing a power semiconductor system (2022-12-27),
13. 11515244 - Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture (2022-11-29),
14. 11302610 - Semiconductor package and method of fabricating a semiconductor package (2022-04-12),
15. 10964628 - Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture (2021-03-30),

Title: The Innovative Journey of Inventor Josef Hoeglauer

Introduction: Josef Hoeglauer, a talented inventor hailing from Heimstetten, Germany, has made significant contributions to the field of innovations with his creative mind and dedication to problem-solving.

Latest Patents: Josef Hoeglauer's latest patents showcase his commitment to pushing the boundaries of technology and improving everyday life for people around the world. His recent inventions focus on sustainability and efficiency in various industries.

Career Highlights: Throughout his illustrious career, Josef Hoeglauer has been recognized for his groundbreaking inventions that have revolutionized the way we live and work. His innovative spirit and attention to detail have led to numerous successful patents in diverse fields.

Collaborations: Josef Hoeglauer has collaborated with leading companies, research institutions, and universities to bring his inventions to life. His partnerships have been instrumental in turning his visionary ideas into tangible products that have a positive impact on society.

Conclusion: In conclusion, Josef Hoeglauer's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of inventors. His remarkable contributions continue to inspire future generations to think outside the box and create solutions that shape a better tomorrow.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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