The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2024
Filed:
Jan. 13, 2022
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Angela Kessler, Sinzing, DE;
Kok Yau Chua, Melaka, MY;
Josef Hoeglauer, Heimstetten, DE;
Chiah Chin Lim, Muar, MY;
Mei Qi Tay, Melaka, MY;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/52 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/538 (2006.01); H01L 31/072 (2012.01); H01L 31/109 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3157 (2013.01); H01L 21/52 (2013.01); H01L 23/49541 (2013.01); H01L 23/5384 (2013.01);
Abstract
A package and method of manufacturing is disclosed. In one example, the package which comprises a carrier with at least one component mounted on the carrier. A clip is arranged above the carrier and having a through hole. At least part of at least one of the at least one component and/or at least part of an electrically conductive connection element electrically connecting the at least one component is at least partially positioned inside the through hole.