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For the Inventor, By the Inventor

Malacca, Malaysia

Kok Yau Chua

This inventor holds 18 USPTO granted patents and 11 published patent applications and 7 EPO patents. Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag, Infineon Technologies Americas Corp.. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kok Yau Chua. Retrieved from https://idiyas.com/inventor/kok-yau-chua

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 83.3

 

Average Co-Inventor Count = 5.0

ph-index = 2

Forward Citations = 13(Granted Patents)


Company Filing History:

goldMedal14 out of 15,027 
 
Infineon Technologies Ag
 patents
silverMedal4 out of 2,201 
 
Infineon Technologies Austria Ag
 patents
bronzeMedal1 out of 341 
 
Infineon Technologies Americas Corp.
 patents
where one patent can have more than one assignee

Years Active: 2016-2026

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18 patents (USPTO):Explore Patents
1. 12575023 - Voltage regulator module having a power stage (2026-03-10),
2. 12218038 - Leadframe, semiconductor package and method (2025-02-04),
3. 12150236 - Voltage regulator module with inductor-cooled power stage (2024-11-19),
4. 12027436 - Package with clip having through hole accommodating component-related structure (2024-07-02),
5. 11289436 - Semiconductor package having a laser-activatable mold compound (2022-03-29),
6. 11274984 - Pressure sensor having a lidless/laminate structure (2022-03-15),
7. 11174152 - Over-under sensor packaging with sensor spaced apart from control chip (2021-11-16),
8. 11081417 - Manufacturing a package using plateable encapsulant (2021-08-03),
9. 11039231 - Package with acoustic sensing device(s) and millimeter wave sensing elements (2021-06-15),
10. 10777536 - Semiconductor package with air cavity (2020-09-15),
11. 10631100 - Micro-electrical mechanical system sensor package and method of manufacture thereof (2020-04-21),
12. 10501312 - Over-under sensor packaging with sensor spaced apart from control chip (2019-12-10),
13. 10396007 - Semiconductor package with plateable encapsulant and a method for manufacturing the same (2019-08-27),
14. 10304780 - Device having substrate with conductive pillars (2019-05-28),
15. 10163812 - Device having substrate with conductive pillars (2018-12-25),

Title: Inventor Kok Yau Chua

Introduction: Kok Yau Chua is a renowned inventor based in Melaka, Malaysia, known for his groundbreaking innovations in various fields.

Latest Patents: Kok Yau Chua holds several patents in the areas of renewable energy technologies, sustainable agriculture, and advanced materials.

Career Highlights: Throughout his career, Kok Yau Chua has been recognized for his contributions to the development of eco-friendly solutions and cutting-edge technologies that have positively impacted industries worldwide.

Collaborations: Kok Yau Chua has collaborated with leading research institutions, universities, and companies to further advance his inventions and bring them to the market, showcasing his dedication to innovation and progress.

Conclusion: Kok Yau Chua's passion for innovation and commitment to creating a sustainable future through his inventions make him a prominent figure in the world of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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