The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2021
Filed:
Jul. 17, 2019
Infineon Technologies Ag, Neubiberg, DE;
Sook Woon Chan, Melaka, MY;
Chau Fatt Chiang, Melaka, MY;
Kok Yau Chua, Melaka, MY;
Soon Lock Goh, Malacca, MY;
Swee Kah Lee, Melaka, MY;
Joachim Mahler, Regensburg, DE;
Mei Chin Ng, Melaka, MY;
Beng Keh See, Melaka, MY;
Guan Choon Matthew Nelson Tee, Malacca, MY;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method of manufacturing a package, comprising embedding the semiconductor chip with an encapsulant comprising a transition metal in a concentration in a range between 10 ppm and 10,000 ppm; selectively converting of a part of the transition metal, such that the electrical conductivity of the encapsulant increases; and plating the converted part of the encapsulant with an electrically conductive material.