IDiyas

For the Inventor, By the Inventor

Melaka, Malaysia

Soon Lock Goh

USPTO Granted Patents = 11 

Average Co-Inventor Count = 4.6

ph-index = 2

Forward Citations = 11(Granted Patents)


Location History:

  • Mutiara, MY (2010)
  • Melaka, MY (2012 - 2019)
  • Malacca, MY (2011 - 2021)

Company Filing History:

goldMedal11 out of 14,705 
 
Infineon Technologies Ag
 patents

Years Active: 2010-2021

where 'Filed Patents' based on already Granted Patents

11 patents (USPTO):
1. 11081417 - Manufacturing a package using plateable encapsulant (2021-08-03),
2. 10431560 - Molded semiconductor package having an optical inspection feature (2019-10-01),
3. 10396007 - Semiconductor package with plateable encapsulant and a method for manufacturing the same (2019-08-27),
4. 9852918 - Embedding additive particles in encapsulant of electronic device (2017-12-26),
5. 9806043 - Method of manufacturing molded semiconductor packages having an optical inspection feature (2017-10-31),
6. 9540539 - Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device (2017-01-10),
7. 9287238 - Leadless semiconductor package with optical inspection feature (2016-03-15),
8. 8945990 - Chip package and method of forming the same (2015-02-03),
9. 8304295 - Method of manufacturing an electronic device with a package locking system (2012-11-06),
10. 7955901 - Method for producing a power semiconductor module comprising surface-mountable flat external contacts (2011-06-07),
11. 7838332 - Method of manufacturing a semiconductor package with a bump using a carrier (2010-11-23),

Title: Innovations of Soon Lock Goh

Introduction

Soon Lock Goh is a prominent inventor based in Melaka, Malaysia. He has made significant contributions to the field of semiconductor packaging, holding a total of 11 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

Among his latest patents is a method for manufacturing a package using a plateable encapsulant. This innovative method involves embedding a semiconductor chip with an encapsulant that contains a transition metal in a specific concentration range. The process selectively converts part of the transition metal to increase the electrical conductivity of the encapsulant, followed by plating the converted part with an electrically conductive material. Another notable patent is for a molded semiconductor package that features an optical inspection capability. This package includes a mold compound with a semiconductor die embedded within it, along with metal pads that are electrically connected to the die. The design allows for certain faces of the metal pads to be uncovered by the mold compound, facilitating effective electrical connections.

Career Highlights

Soon Lock Goh is currently employed at Infineon Technologies AG, where he continues to innovate in semiconductor technology. His expertise and dedication have positioned him as a key player in the industry, contributing to advancements that enhance product performance and reliability.

Collaborations

He collaborates with talented colleagues, including Swee Kah Lee and Joachim Mahler, to drive forward innovative projects and solutions in semiconductor packaging.

Conclusion

Soon Lock Goh's contributions to the field of semiconductor technology through his patents and collaborations highlight his role as a leading inventor. His work continues to influence the industry and pave the way for future innovations.

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