The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2016
Filed:
Dec. 02, 2013
Infineon Technologies Ag, Neubiberg, DE;
Soon Lock Goh, Melaka, MY;
Swee Kah Lee, Melaka, MY;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor package includes a plurality of bond pads having a first side and a second side opposing the first side, a coating covering the first side of the bond pads, semiconductor dies and electrical conductors attached to the second side of the bond pads, and a molding compound encasing the semiconductor dies and the electrical conductors at the second side of the bonds pads. The molding compound has a first side through which the bond pads protrude and a second side opposing the first side, the first side of the molding compound having a planar surface between adjacent ones of the bond pads. The package further includes a material plated on exposed sidewalls of the bonds pads uncovered by the molding compound and which is detectable by optical inspection. A corresponding method of manufacture is also provided.