The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2015
Filed:
Apr. 24, 2012
Holger Torwesten, Regensburg, DE;
Manfred Mengel, Bad Abbach, DE;
Stefan Schmid, Painten, DE;
Soon Lock Goh, Melaka, MY;
Swee Kah Lee, Melaka, MY;
Holger Torwesten, Regensburg, DE;
Manfred Mengel, Bad Abbach, DE;
Stefan Schmid, Painten, DE;
Soon Lock Goh, Melaka, MY;
Swee Kah Lee, Melaka, MY;
Infineon Technologies AG, Neubiberg, DE;
Abstract
Embodiments provide a method of forming a chip package. The method may include attaching at least one chip on a carrier, the chip including a plurality of chip pads on a surface of the chip opposite to the carrier; depositing a first adhesion layer on the carrier and on the chip pads of the chip, the first adhesion layer including tin or indium; depositing a second adhesion layer on the first adhesion layer, the second adhesion layer including a silane organic material; and depositing a lamination layer or an encapsulation layer on the second adhesion layer and the chip.