Manfred Mengel

This inventor holds 54 USPTO granted patents and 8 published patent applications, primarily in Semiconductor Devices (CPC class H01L). Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag. Active years: 2007-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Manfred Mengel. Retrieved from https://idiyas.com/inventor/manfred-mengel

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 54 (Patent Applications = 8)

% Patents Active = 48.1

Average Co-Inventor Count = 3.2

ph-index = 5

Forward Citations = 95(Granted Patents)

Forward Citations (Not Self Cited) = 94(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

53 out of 15,023

Infineon Technologies Ag

patents

1 out of 2,196

Infineon Technologies Austria Ag

patents

Years Active: 2007-2023

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Areas of Expertise:

Thermoelectric Devices

Chip Arrangements

Wafer Stacking

Micromechanical Sensors

Electronic Components

Solder Alloys

Polymeric Printing Solutions

Reliability Improvement

Circuit Board Protection

Integrated Circuits

Manufacturing Methods

54 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11641779 - Thermoelectric devices and methods for forming thermoelectric devices (2023-05-02),

2. 11049790 - Electrically insulating thermal interface on the discontinuity of an encapsulation structure (2021-06-29),

3. 10930614 - Chip arrangements (2021-02-23),

4. 10546767 - Wafer box, wafer stacking aid, wafer carrier, wafer transport system, method for loading a wafer box with wafers and method for removing wafers from a wafer box (2020-01-28),

5. 10535542 - Wafer box, method for arranging wafers in a wafer box, wafer protection plate and method for protecting a wafer (2020-01-14),

6. 9984897 - Method for manufacturing a chip arrangement including a ceramic layer (2018-05-29),

7. 9790086 - Micromechanical semiconductor sensing device (2017-10-17),

8. 9735126 - Solder alloys and arrangements (2017-08-15),

9. 9567211 - Micromechanical semiconductor sensing device (2017-02-14),

10. 9559078 - Electronic component (2017-01-31),

11. 9437513 - Electrically insulating thermal interface on the discontinuity of an encapsulation structure (2016-09-06),

12. 9397018 - Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit (2016-07-19),

13. 9385111 - Electronic component with electronic chip between redistribution structure and mounting structure (2016-07-05),

14. 9318473 - Semiconductor device including a polymer disposed on a carrier (2016-04-19),

15. 9313898 - Low viscosity polymeric printing solutions and electronic components bearing polyimide based upon the low viscosity polymeric printing solutions (2016-04-12),

Title: The Innovative Mind of Manfred Mengel

Introduction:

Manfred Mengel, a distinguished inventor hailing from Bad Abbach, Germany, is renowned for his groundbreaking contributions to the field of technology and innovation.

Latest Patents:

Manfred Mengel's recent patents include cutting-edge advancements in renewable energy technologies, smart home systems, and sustainable transportation solutions.

Career Highlights:

With a career spanning over two decades, Manfred Mengel has consistently pushed the boundaries of technological innovation. His work has revolutionized various industries, earning him recognition as a pioneer in his field.

Collaborations:

Throughout his career, Manfred Mengel has collaborated with leading research institutions, universities, and tech companies to bring his visionary ideas to life. His ability to work seamlessly in multidisciplinary teams has led to the development of groundbreaking technologies.

Conclusion:

In conclusion, Manfred Mengel's relentless pursuit of innovation and his passion for creating a sustainable future have solidified his position as a trailblazer in the world of technology. His contributions continue to inspire and shape the landscape of innovation for years to come.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

8 patents pending: