The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

Jun. 07, 2011
Applicants:

Manfred Mengel, Bad Abbach, DE;

Alexander Heinrich, Regensburg, DE;

Steffen Orso, Reutlingen, DE;

Thomas Behrens, Wenzenbach, DE;

Oliver Eichinger, Regensburg, DE;

Lim Fong, Melaka, MY;

Evelyn Napetschnig, Diex, AT;

Edmund Riedl, Obertraubling, DE;

Inventors:

Manfred Mengel, Bad Abbach, DE;

Alexander Heinrich, Regensburg, DE;

Steffen Orso, Reutlingen, DE;

Thomas Behrens, Wenzenbach, DE;

Oliver Eichinger, Regensburg, DE;

Lim Fong, Melaka, MY;

Evelyn Napetschnig, Diex, AT;

Edmund Riedl, Obertraubling, DE;

Assignee:

INFINEON TECHNOLOGIES AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); B23K 35/30 (2006.01); B23K 35/26 (2006.01); B23K 35/28 (2006.01); C22C 13/00 (2006.01); C22C 18/00 (2006.01); C22C 18/04 (2006.01); C22C 30/04 (2006.01); C22C 30/06 (2006.01); H01L 23/488 (2006.01); B23K 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); B23K 1/0016 (2013.01); B23K 35/262 (2013.01); B23K 35/282 (2013.01); B23K 35/3013 (2013.01); C22C 13/00 (2013.01); C22C 18/00 (2013.01); C22C 18/04 (2013.01); C22C 30/04 (2013.01); C22C 30/06 (2013.01); H01L 23/488 (2013.01); H01L 23/49513 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/73 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29118 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45099 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45155 (2013.01); H01L 2224/45164 (2013.01); H01L 2224/45169 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83 (2013.01); H01L 2224/85455 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/15747 (2013.01);
Abstract

A solder alloy is providing, the solder alloy including zinc, aluminum, magnesium and gallium, wherein the aluminum constitutes by weight 8% to 20% of the alloy, the magnesium constitutes by weight 0.5% to 20% of the alloy and the gallium constitutes by weight 0.5% to 20% of the alloy, the rest of the alloy including zinc.


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