Lim Fong

Title: The Innovations of Lim Fong

Introduction

Lim Fong is a notable inventor based in Melaka, Malaysia. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on advanced chip arrangements and solder alloys, which are crucial for enhancing the performance and reliability of electronic devices.

Latest Patents

Among Lim Fong's latest patents is a chip arrangement that includes a chip with a back side metallization comprising multiple layers. This innovative design utilizes a zinc-based solder alloy that ensures strong attachment to a metal layer on a substrate. The alloy is formulated with specific percentages of aluminum, magnesium, and gallium, which optimize its wettability and performance. Another significant patent involves a solder alloy that combines zinc, aluminum, magnesium, and gallium, designed to improve the overall quality and durability of solder joints in electronic applications.

Career Highlights

Throughout his career, Lim Fong has worked with prominent companies in the semiconductor industry. He has been associated with National Semiconductor Corporation and Infineon Technologies AG, where he contributed to various projects that advanced semiconductor technology. His expertise in chip design and solder materials has made him a valuable asset in these organizations.

Collaborations

Lim Fong has collaborated with several professionals in his field, including Jaime A Bayan and Nghia Thuc Tu. These collaborations have fostered innovation and the exchange of ideas, further enhancing the quality of his work.

Conclusion

Lim Fong's contributions to semiconductor technology through his patents and career achievements highlight his role as a significant inventor in the industry. His innovative designs and materials continue to influence the development of electronic devices.