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For the Inventor, By the Inventor

Wald, Germany

Edmund Riedl

USPTO Granted Patents = 28 

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 60(Granted Patents)


Location History:

  • Gebelhofen, DE (2008)
  • Obertraubling-Gebelkofen, DE (2009 - 2013)
  • Gebelkofen, DE (2010 - 2013)
  • Obertraubling, DE (2004 - 2017)
  • Wald, DE (2019 - 2023)

Company Filing History:

goldMedal28 out of 14,705 
 
Infineon Technologies Ag
 patents

Years Active: 2004-2025

where 'Filed Patents' based on already Granted Patents

28 patents (USPTO):
1. 12288727 - Method of manufacturing a package having an adhesion promoter (2025-04-29),
2. 12136578 - Interlayer of sub-structure having elevations and further sub-structure with filler particles in recesses between the elevations (2024-11-05),
3. 11652012 - Inorganic encapsulant for electronic component with adhesion promoter (2023-05-16),
4. 11450642 - Soldering a conductor to an aluminum metallization (2022-09-20),
5. 11328935 - Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package (2022-05-10),
6. 10930614 - Chip arrangements (2021-02-23),
7. 10896893 - Soldering a conductor to an aluminum metallization (2021-01-19),
8. 10892247 - Soldering a conductor to an aluminum metallization (2021-01-12),
9. 10734352 - Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement (2020-08-04),
10. 10615145 - Soldering a conductor to an aluminum metallization (2020-04-07),
11. 10366946 - Connection member with bulk body and electrically and thermally conductive coating (2019-07-30),
12. 9735126 - Solder alloys and arrangements (2017-08-15),
13. 8603864 - Method of fabricating a semiconductor device (2013-12-10),
14. 8410586 - Semiconductor package and method of assembling a semiconductor package (2013-04-02),
15. 8177878 - Bonding material with exothermically reactive heterostructures (2012-05-15),

Title: Edmund Riedl: Innovator in Electronics Packaging

Introduction: Edmund Riedl is a notable inventor based in Wald, Germany, recognized for his contributions to the field of electronics packaging. With an impressive portfolio of 28 patents, Riedl has consistently demonstrated his commitment to advancing technology through innovative solutions.

Latest Patents: Riedl's latest patents showcase his expertise in enhancing electronic component manufacturing processes. One of his recent inventions is the "Method of manufacturing a package having an adhesion promoter." This method involves forming a morphological adhesion promoter on electronic components, which enhances the adhesion between the component and an inorganic encapsulant. Another significant patent is the "Interlayer of sub-structure having elevations and further sub-structure with filler particles in recesses between the elevations." This innovation describes a composite structure that improves the integration of materials, leading to better performance in electronic applications.

Career Highlights: Riedl has spent a significant portion of his career with Infineon Technologies AG, a leading global semiconductor company. His work at Infineon has allowed him to develop groundbreaking technologies that contribute to the enhancement of electronic devices. His patents not only reflect his technical expertise but also his vision for improving industry standards.

Collaborations: Throughout his career, Riedl has collaborated with esteemed colleagues such as Alexander Heinrich and Ralf Otremba. These partnerships have played a crucial role in the development of innovative products and solutions, further solidifying Riedl's status as a prominent figure in the field.

Conclusion: Edmund Riedl is a significant contributor to the world of electronics, continuously pushing the boundaries of innovation. His patents reflect a deep understanding of the complexities involved in electronic packaging and the importance of enhancing adhesion between materials. As technology advances, Riedl's work will undoubtedly leave a lasting impact on the industry.

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