The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Oct. 01, 2018
Infineon Technologies Ag, Neubiberg, DE;
Irmgard Escher-Poeppel, Duggendorf, DE;
Khalil Hosseini, Weihmichl, DE;
Johannes Lodermeyer, Kinding, DE;
Joachim Mahler, Regensburg, DE;
Thorsten Meyer, Regensburg, DE;
Georg Meyer-Berg, Munich, DE;
Ivan Nikitin, Regensburg, DE;
Reinhard Pufall, Munich, DE;
Edmund Riedl, Wald, DE;
Klaus Schmidt, Nittendorf, DE;
Manfred Schneegans, Vaterstetten, DE;
Patrick Schwarz, Kallmuenz, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A metallic interconnection and a semiconductor arrangement including the same are described, wherein a method of manufacturing the same may include: providing a first structure including a first metallic layer having protruding first microstructures; providing a second structure including a second metallic layer having protruding second microstructures; contacting the first and second microstructures to form a mechanical connection between the structures, the mechanical connection being configured to allow fluid penetration; removing one or more non-metallic compounds on the first metallic layer and the second metallic layer with a reducing agent that penetrates the mechanical connection and reacts with the one or more non-metallic compounds; and heating the first metallic layer and the second metallic layer at a temperature causing interdiffusion of the first metallic layer and the second metallic layer to form the metallic interconnection between the structures.