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For the Inventor, By the Inventor

Kinding, Germany

Johannes Lodermeyer

USPTO Granted Patents = 12 

Average Co-Inventor Count = 5.0

ph-index = 3

Forward Citations = 62(Granted Patents)


Location History:

  • Regensburg, DE (2013 - 2016)
  • Kinding, DE (2011 - 2022)

Company Filing History:

goldMedal11 out of 14,705 
 
Infineon Technologies Ag
 patents
silverMedal1 out of 2,093 
 
Infineon Technologies Austria Ag
 patents

Years Active: 2011-2025

where 'Filed Patents' based on already Granted Patents

12 patents (USPTO):
1. 12368111 - Semiconductor apparatuses with radio-frequency line elements, and associated manufacturing methods (2025-07-22),
2. 11387533 - Semiconductor package with plastic waveguide (2022-07-12),
3. 10923364 - Methods for producing packaged semiconductor devices (2021-02-16),
4. 10734352 - Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement (2020-08-04),
5. 10571682 - Tilted chip assembly for optical devices (2020-02-25),
6. 10549985 - Semiconductor package with a through port for sensor applications (2020-02-04),
7. 9437516 - Chip-embedded packages with backside die connection (2016-09-06),
8. 9331060 - Device including two power semiconductor chips and manufacturing thereof (2016-05-03),
9. 8975711 - Device including two power semiconductor chips and manufacturing thereof (2015-03-10),
10. 8603864 - Method of fabricating a semiconductor device (2013-12-10),
11. 7989930 - Semiconductor package (2011-08-02),
12. 7909978 - Method of making an integrated circuit including electrodeposition of metallic chromium (2011-03-22),

Title: Innovations of Johannes Lodermeyer

Introduction

Johannes Lodermeyer is a notable inventor based in Kinding, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 12 patents. His work focuses on advanced semiconductor apparatuses and their manufacturing methods.

Latest Patents

Among his latest patents, Lodermeyer has developed a semiconductor apparatus that includes radio-frequency line elements. This apparatus features a circuit board and a semiconductor package with a main surface facing the circuit board. The radio-frequency line element is designed to transmit signals at frequencies greater than 10 GHz, ensuring high-performance communication. Another notable patent is for a semiconductor package with a plastic waveguide. This device includes an Integrated Circuit (IC) package with a semiconductor chip and an embedded antenna, which is configured to transport Radio Frequency (RF) signals efficiently.

Career Highlights

Lodermeyer has worked with prominent companies in the semiconductor industry, including Infineon Technologies AG and Infineon Technologies Austria AG. His experience in these organizations has allowed him to refine his expertise in semiconductor technologies and contribute to innovative solutions in the field.

Collaborations

Throughout his career, Lodermeyer has collaborated with esteemed colleagues such as Joachim Mahler and Edmund Riedl. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Johannes Lodermeyer is a distinguished inventor whose work in semiconductor technology has resulted in numerous patents and innovations. His contributions continue to influence the industry and pave the way for future advancements.

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