The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
Dec. 20, 2018
Infineon Technologies Ag, Neubiberg, DE;
Walter Hartner, Bad Abbach-Peissing, DE;
Christian Geissler, Teugn, DE;
Thomas Kilger, Regenstauf, DE;
Johannes Lodermeyer, Kinding, DE;
Franz-Xaver Muehlbauer, Rimbach, DE;
Martin Richard Niessner, Munich, DE;
Claus Waechter, Sinzing, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor apparatus comprises: a circuit board; a semiconductor package having a main surface, wherein the semiconductor package is arranged on the circuit board and the main surface faces the circuit board; a radio-frequency line element of the semiconductor package, which radio-frequency line element is arranged on the main surface or inside the semiconductor package, wherein the radio-frequency line element is designed to transmit a signal at a frequency of greater than 10 GHz; and an underfiller material arranged between the circuit board and the semiconductor package, wherein the radio-frequency line element and the underfiller material do not overlap in an orthogonal projection onto the main surface.