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For the Inventor, By the Inventor

Teugn, Germany

Christian Geissler

This inventor holds 49 USPTO granted patents and 14 published patent applications and 4 EPO patents, primarily in Semiconductor Packaging. Top assignees: Intel Corporation, Infineon Technologies Ag, Infineon Technologies Austria Ag. Active years: 2008-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Christian Geissler. Retrieved from https://idiyas.com/inventor/christian-geissler

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 49 

% Patents Active = 87.8

 

Average Co-Inventor Count = 5.2

ph-index = 5

Forward Citations = 147(Granted Patents)


Location History:

  • Regensburg, DE (2008 - 2017)
  • Teugn, DE (2014 - 2024)

Company Filing History:

goldMedal30 out of 56,322 
 
Intel Corporation
 patents
silverMedal12 out of 15,027 
 
Infineon Technologies Ag
 patents
bronzeMedal3 out of 2,201 
 
Infineon Technologies Austria Ag
 patents
4. 1 out of 254 
 
Intel Deutschland Gmbh
 patents
5. 1 out of 30 
 
Intel IP Corporation
 patents
6. 1 out of 1 
 
Intel IP Corportaion
 patent
7. 1 out of 511 
 
Intel Mobile Communications Gmbh
 patents

Years Active: 2008-2025

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Areas of Expertise:
Semiconductor Apparatuses
Radio-Frequency Devices
Wafer-Level Package
MEMS Assemblies
Chip to Wafer Bonding
Three-Dimensional Capacitors
Vertical Wire Connections
System-in-Package
Integrated Circuit Packages
Optical Redistribution Layer
Thermal Resistance
Microelectronic Package
49 patents (USPTO):Explore Patents
1. 12368111 - Semiconductor apparatuses with radio-frequency line elements, and associated manufacturing methods (2025-07-22),
2. 12158448 - Radiation source device (2024-12-03),
3. 12040543 - Radio-frequency devices and methods for producing radio-frequency devices (2024-07-16),
4. 11955462 - Package stacking using chip to wafer bonding (2024-04-09),
5. 11505450 - Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package (2022-11-22),
6. 11424209 - Wafer level package structure with internal conductive layer (2022-08-23),
7. 11239199 - Package stacking using chip to wafer bonding (2022-02-01),
8. 11145563 - Semiconductor devices having cutouts in an encapsulation material and associated production methods (2021-10-12),
9. 10916484 - Electronic device including redistribution layer pad having a void (2021-02-09),
10. 10899604 - Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package (2021-01-26),
11. 10854590 - Semiconductor die package with more than one hanging die (2020-12-01),
12. 10816742 - Integrated circuit packages including an optical redistribution layer (2020-10-27),
13. 10793429 - Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assembly (2020-10-06),
14. 10741486 - Electronic components having three-dimensional capacitors in a metallization stack (2020-08-11),
15. 10672731 - Wafer level package structure with internal conductive layer (2020-06-02),

Title: Christian Geissler: Pioneering Innovation Towards a Sustainable Future

Introduction:

Inventor Christian Geissler, hailing from Teugn, Germany, is a visionary whose passion for innovation and dedication to excellence continue to shape the world of technology. His remarkable contributions have not only enhanced our daily lives, but have also set the stage for a more sustainable and technologically advanced future.

Latest Patents:

Christian Geissler holds an impressive portfolio of 46 patents, showcasing his expertise in cutting-edge technologies. Among his latest patents are groundbreaking inventions such as "Package stacking using chip to wafer bonding" and "Integration of stress decoupling and particle filter on a single wafer or in combination with a wafer-level package." These inventions signify Geissler's commitment to pushing the boundaries of semiconductor technology.

Career Highlights:

Having worked with prestigious companies like Intel Corporation and Infineon Technologies AG, Christian Geissler has honed his skills and expertise in the field of semiconductor technology. His innovative approach and keen eye for detail have led to the development of groundbreaking solutions that have revolutionized the industry.

Collaborations:

Throughout his career, Christian Geissler has collaborated with esteemed professionals such as Georg Seidemann and Sven Albers. Together, they have spearheaded projects that have set new benchmarks in semiconductor technology and paved the way for future innovations.

Conclusion:

Christian Geissler's unwavering dedication to innovation and his relentless pursuit of excellence serve as an inspiration to aspiring inventors and technologists worldwide. His pioneering work not only reflects his passion for advancing technology but also underscores his commitment to creating a more sustainable and interconnected world. As we look towards the future, Christian Geissler's contributions will continue to shape the landscape of technology and drive us towards a more innovative and sustainable tomorrow.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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