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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10916484 B1

PDFFull Text
Date of Patent:
Feb. 09, 2021

Filed:

Jun. 21, 2018

Electronic device including redistribution layer pad having a void

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Robert Fehler, Regensburg, DE;

Francesca Arcioni, Munich, DE;

Christian Geissler, Teugn, DE;

Walter Hartner, Bad Abbach-Peissing, DE;

Gerhard Haubner, Regensburg, DE;

Thorsten Meyer, Regensburg, DE;

Martin Richard Niessner, Munich, DE;

Maciej Wojnowski, Munich, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Dicke, Billig & Czaja, PLLC

Primary Examiner:

Earl N Taylor

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 23/538 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3171 (2013.01); H01L 23/49816 (2013.01); H01L 23/5389 (2013.01); H01L 24/05 (2013.01); H01L 23/49811 (2013.01); H01L 24/13 (2013.01); H01L 2224/0233 (2013.01); H01L 2224/0235 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05011 (2013.01); H01L 2224/05012 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/0558 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13006 (2013.01); H01L 2224/13024 (2013.01);
Abstract

An electronic device is disclosed. In one example, the electronic device includes a solder ball, a dielectric layer comprising an opening, and a redistribution layer (RDL) comprising an RDL pad connected with the solder ball. The RDL pad including at least one void, the void being disposed at least in partial in an area of the RDL pad laterally outside of the opening of the dielectric layer.

Find Patent Forward Citations

Fehler, Robert. (2021). Electronic device including redistribution layer pad having a void (U.S. Patent No. 10916484). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10916484

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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