The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2021
Filed:
Jun. 21, 2018
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Robert Fehler, Regensburg, DE;
Francesca Arcioni, Munich, DE;
Christian Geissler, Teugn, DE;
Walter Hartner, Bad Abbach-Peissing, DE;
Gerhard Haubner, Regensburg, DE;
Thorsten Meyer, Regensburg, DE;
Martin Richard Niessner, Munich, DE;
Maciej Wojnowski, Munich, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 23/538 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3171 (2013.01); H01L 23/49816 (2013.01); H01L 23/5389 (2013.01); H01L 24/05 (2013.01); H01L 23/49811 (2013.01); H01L 24/13 (2013.01); H01L 2224/0233 (2013.01); H01L 2224/0235 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05011 (2013.01); H01L 2224/05012 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/0558 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13006 (2013.01); H01L 2224/13024 (2013.01);
Abstract
An electronic device is disclosed. In one example, the electronic device includes a solder ball, a dielectric layer comprising an opening, and a redistribution layer (RDL) comprising an RDL pad connected with the solder ball. The RDL pad including at least one void, the void being disposed at least in partial in an area of the RDL pad laterally outside of the opening of the dielectric layer.