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For the Inventor, By the Inventor

Munich, Germany

Maciej Wojnowski

USPTO Granted Patents = 40 


Average Co-Inventor Count = 4.0

ph-index = 7

Forward Citations = 296(Granted Patents)


Location History:

  • München, DE (2018 - 2019)
  • Munich, DE (2012 - 2024)

Company Filing History:

goldMedal36 out of 14,705 
 
Infineon Technologies Ag
 patents
silverMedal4 out of 2,093 
 
Infineon Technologies Austria Ag
 patents

Years Active: 2012-2024

where 'Filed Patents' based on already Granted Patents

40 patents (USPTO):
1. 12094842 - Semiconductor device having an antenna arranged over an active main surface of a semiconductor die (2024-09-17),
2. 12040543 - Radio-frequency devices and methods for producing radio-frequency devices (2024-07-16),
3. 12014998 - Semiconductor devices comprising a radar semiconductor chip and associated production methods (2024-06-18),
4. 11996771 - Power semiconductor system having an inductor module attached to a power stage module (2024-05-28),
5. 11879966 - Transmission of wireless signal having information on a local oscillator signal (2024-01-23),
6. 11872853 - Selective activation of tire pressure monitoring system (TPMS) sensor modules for radio-frequency (RF) communication using directional RF beams (2024-01-16),
7. 11824019 - Chip package with substrate integrated waveguide and waveguide interface (2023-11-21),
8. 11658135 - Semiconductor devices comprising a radar semiconductor chip and associated production methods (2023-05-23),
9. 11539291 - Method of manufacturing a power semiconductor system (2022-12-27),
10. 11387533 - Semiconductor package with plastic waveguide (2022-07-12),
11. 11355838 - Integration of EBG structures (single layer/multi-layer) for isolation enhancement in multilayer embedded packaging technology at mmWave (2022-06-07),
12. 11251146 - Semiconductor devices having a non-galvanic connection (2022-02-15),
13. 11195787 - Semiconductor device including an antenna (2021-12-07),
14. 11145563 - Semiconductor devices having cutouts in an encapsulation material and associated production methods (2021-10-12),
15. 10930541 - Method of forming a chip arrangement, chip arrangement, method of forming a chip package, and chip package (2021-02-23),

Title: Inventor Maciej Wojnowski - Revolutionizing Technology in Munich

Introduction: Maciej Wojnowski is a visionary inventor based in Munich, Germany, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Maciej Wojnowski holds several patents in the areas of artificial intelligence, renewable energy, and biotechnology, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With over two decades of experience in the tech industry, Maciej Wojnowski has worked with leading research institutions and multinational companies to develop cutting-edge solutions that have revolutionized various sectors.

Collaborations: Throughout his career, Maciej Wojnowski has collaborated with top scientists, engineers, and entrepreneurs to bring his ideas to life, leading to successful partnerships and groundbreaking inventions that have had a lasting impact on the industry.

Conclusion: Maciej Wojnowski's passion for innovation and his relentless pursuit of excellence continue to drive him to push the boundaries of technology, making him a respected figure in the world of inventions and patents.

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