The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2024
Filed:
Dec. 22, 2022
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Petteri Palm, Regensburg, DE;
Frank Daeche, Unterhaching, DE;
Zeeshan Umar, Munich, DE;
Andrew Sawle, East Grinstead, GB;
Maciej Wojnowski, Munich, DE;
Xaver Schloegel, Sachsenkam, DE;
Josef Hoeglauer, Heimstetten, DE;
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 3/15 (2006.01); H01F 17/00 (2006.01); H01F 17/06 (2006.01); H01F 27/255 (2006.01); H01F 41/04 (2006.01); H02M 3/155 (2006.01); H02M 3/158 (2006.01); H01F 27/06 (2006.01); H02M 1/00 (2006.01);
U.S. Cl.
CPC ...
H02M 3/155 (2013.01); H01F 17/0033 (2013.01); H01F 17/062 (2013.01); H01F 27/255 (2013.01); H01F 41/046 (2013.01); H02M 3/158 (2013.01); H01F 2027/065 (2013.01); H02M 1/0048 (2021.05); H02M 1/0054 (2021.05); Y10T 29/4913 (2015.01);
Abstract
A power semiconductor system includes: a power stage module having one or more power transistor dies attached to or embedded in a first printed circuit board; and an inductor module attached to the power stage module and having an inductor electrically connected to an output node of the power stage module. The inductor includes windings patterned into a second printed circuit board of the inductor module.