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For the Inventor, By the Inventor

East Grinstead, United Kingdom

Andrew Neil Sawle

This inventor holds 34 USPTO granted patents and 2 published patent applications and 9 EPO patents, primarily in Power Semiconductor Packaging. Top assignees: International Rectifier Corporation, Infineon Technologies Americas Corp., Infineon Technologies Austria Ag. Active years: 2005-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Andrew Neil Sawle. Retrieved from https://idiyas.com/inventor/andrew-neil-sawle

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 34 

% Patents Active = 82.4

 

Average Co-Inventor Count = 3.5

ph-index = 7

Forward Citations = 117(Granted Patents)


Location History:

  • West Sussex, GB (2005 - 2013)
  • E. Grinstead, GB (2014)
  • Copthorne, GB (2020)
  • East Grinstead, GB (2007 - 2024)

Company Filing History:

goldMedal15 out of 1,231 
 
International Rectifier Corporation
 patents
silverMedal14 out of 341 
 
Infineon Technologies Americas Corp.
 patents
bronzeMedal4 out of 2,201 
 
Infineon Technologies Austria Ag
 patents
4. 1 out of 166,351 
 
International Business Machines Corporation
 patents

Years Active: 2005-2024

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Areas of Expertise:
Power Semiconductor
Inductor Modules
Solderable Contacts
Stacked Half-Bridge
Semiconductor Package
Conductive Carrier
Thermal Management
Power Converter
Chip-Scale Package
Vertical Stacking
Heat Dissipation
Surface Mounted
34 patents (USPTO):Explore Patents
1. 11996771 - Power semiconductor system having an inductor module attached to a power stage module (2024-05-28),
2. 11539291 - Method of manufacturing a power semiconductor system (2022-12-27),
3. 10833583 - Methods of manufacturing inductor modules and power semiconductor systems having inductor modules (2020-11-10),
4. 10601314 - Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modules (2020-03-24),
5. 10103076 - Semiconductor package including a semiconductor die having redistributed pads (2018-10-16),
6. 9852940 - Method for forming a reliable solderable contact (2017-12-26),
7. 9852939 - Solderable contact and passivation for semiconductor dies (2017-12-26),
8. 9673109 - Method for fabricating a semiconductor package with conductive carrier integrated heat spreader (2017-06-06),
9. 9633951 - Semiconductor package including a semiconductor die having redistributed pads (2017-04-25),
10. 9601418 - Stacked half-bridge package (2017-03-21),
11. 9583477 - Stacked half-bridge package (2017-02-28),
12. 9576887 - Semiconductor package including conductive carrier coupled power switches (2017-02-21),
13. 9502395 - Power semiconductor package having vertically stacked driver IC (2016-11-22),
14. 9461022 - Power semiconductor package with a common conductive clip (2016-10-04),
15. 9397212 - Power converter package including top-drain configured power FET (2016-07-19),

Title: Andrew Neil Sawle - Innovative Inventor from East Grinstead

Introduction: Andrew Neil Sawle is a renowned inventor hailing from East Grinstead, United Kingdom, known for his groundbreaking contributions to various industries.

Latest Patents: Andrew Neil Sawle holds several patents in the fields of technology and engineering, with his most recent inventions focusing on sustainable energy solutions and advanced robotics.

Career Highlights: With a career spanning over two decades, Sawle has worked with leading research institutions and universities to develop cutting-edge technologies that have revolutionized the way we live and work.

Collaborations: Throughout his career, Andrew Neil Sawle has collaborated with top companies and brilliant minds in the industry, fostering a culture of innovation and creativity that has led to numerous successful projects.

Conclusion: Andrew Neil Sawle's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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