The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2020
Filed:
Mar. 06, 2020
Infineon Technologies Austria Ag, Villach, AT;
Petteri Palm, Regensburg, DE;
Frank Daeche, Unterhaching, DE;
Zeeshan Umar, Munich, DE;
Andrew Sawle, Copthorne, GB;
Maciej Wojnowski, Munich, DE;
Xaver Schloegel, Sachsenkam, DE;
Josef Hoeglauer, Heimstetten, DE;
Infineon Technologies Austria AG, Villach, AT;
Abstract
A method of manufacturing a power semiconductor system includes providing a power stage module having one or more power transistor dies attached to or embedded in a first printed circuit board and attaching an inductor module to the power stage module such that the inductor module is electrically connected to an output node of the power stage module. The inductor module includes a ferrite sheet embedded in a second printed circuit board and windings patterned into the second printed circuit board. Further methods of manufacturing power semiconductor systems and methods of manufacturing inductor modules are also described.