IDiyas

For the Inventor, By the Inventor

Wuppertal, Germany

Petteri Palm

USPTO Granted Patents = 84 

 

Average Co-Inventor Count = 2.5

ph-index = 8

Forward Citations = 285(Granted Patents)

DiyaCoin DiyaCoin = 0.52 


Inventors with similar research interests:


Location History:

  • Helsinkin, FI (2012 - 2013)
  • Espoo, FI (2012 - 2014)
  • Helsinski, FI (2014)
  • Regensburg, FI (2015)
  • Helsinki, FI (2007 - 2019)
  • Regensburg, DE (2015 - 2024)
  • Stein, DE (2023 - 2024)

Company Filing History:

goldMedal34 out of 14,705 
 
Infineon Technologies Ag
 patents
silverMedal18 out of 2,093 
 
Infineon Technologies Austria Ag
 patents
bronzeMedal15 out of 26 
 
Imbera Electronics Oy
 patents
4. 13 out of 25 
 
Ge Embedded Electronics Oy
 patents
5. 4 out of 8 
 
Imberatek, LLC
 patents
6. 1 out of 278 
 
Infineon Technologies Americas Corp.
 patents
where one patent can have more than one assignee

Years Active: 2007-2025

where 'Filed Patents' based on already Granted Patents

84 patents (USPTO):
1. 12431450 - Device including semiconductor chips and method for producing such device (2025-09-30),
2. 12414236 - Electronic device with castellated board (2025-09-09),
3. 12315835 - Pre-packaged chip, method of manufacturing a pre-packaged chip, semiconductor package and method of manufacturing a semiconductor package (2025-05-27),
4. 12284753 - Electrostatic discharge protection of electronic component embedded in laminate of printed circuit board (2025-04-21),
5. 12237246 - Semiconductor devices including parallel electrically conductive layers (2025-02-25),
6. 12218098 - Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate (2025-02-04),
7. 12176283 - Die package and method of forming a die package (2024-12-24),
8. 12159829 - Semiconductor package with non-uniformly distributed vias (2024-12-03),
9. 12094807 - Stacked transistor chip package with source coupling (2024-09-17),
10. 12080669 - Semiconductor device module having vertical metallic contacts and a method for fabricating the same (2024-09-03),
11. 12033909 - Die package and method of manufacturing a die package (2024-07-09),
12. 12027481 - Device including semiconductor chips and method for producing such device (2024-07-02),
13. 12014964 - Semiconductor package having an electrically insulating core with exposed glass fibres (2024-06-18),
14. 12009290 - Semiconductor module having a multi-branch switch node connector (2024-06-11),
15. 11996771 - Power semiconductor system having an inductor module attached to a power stage module (2024-05-28),

Title: The Innovative Journey of Petteri Palm

Introduction: Petteri Palm is a visionary inventor based in Regensburg, Germany, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Petteri Palm holds several patents in the areas of renewable energy, sustainable transportation, and smart city solutions, showcasing his commitment to creating a more efficient and eco-friendly world.

Career Highlights: With a background in engineering and a passion for problem-solving, Petteri Palm has successfully developed cutting-edge technologies that have revolutionized industries. His innovative spirit and dedication to excellence have earned him recognition as a leading figure in the innovation landscape.

Collaborations: Throughout his career, Petteri Palm has collaborated with top research institutions, universities, and forward-thinking companies to bring his inventions to life. His ability to work effectively in multidisciplinary teams has led to the successful implementation of his ideas on a global scale.

Conclusion: Petteri Palm's relentless pursuit of innovation and his remarkable contributions to the world of technology make him a true pioneer in his field, inspiring the next generation of inventors to push the boundaries of what is possible.

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