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For the Inventor, By the Inventor

Nittendorf, Germany

Gottfried Beer

USPTO Granted Patents = 87 

Average Co-Inventor Count = 2.8

ph-index = 13

Forward Citations = 682(Granted Patents)

Forward Citations (Not Self Cited) = 659(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Regensburg, DE (2015)
  • Nittendorf, DE (2000 - 2022)

Company Filing History:

goldMedal75 out of 14,724 
 
Infineon Technologies Ag
 patents
silverMedal5 out of 511 
 
Intel Mobile Communications Gmbh
 patents
bronzeMedal3 out of 254 
 
Intel Deutschland Gmbh
 patents
4. 2 out of 30,045 
 
Siemens Aktiengesellschaft
 patents
5. 1 out of 90 
 
Ezconn Corporation
 patents
6. 1 out of 54,750 
 
Intel Corporation
 patents

Years Active: 2000-2022

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Areas of Expertise:
Power Semiconductor Module
Vertical Ferrite Antenna
Current Sensor Device
Photo-Acoustic Gas Sensor
Embedded Chip Packages
Semiconductor Packaging
Smart Card Module
On-Chip RF Shields
Semiconductor Arrangement
Chip Assembly
Integrated Passive Components
87 patents (USPTO):Explore Patents
1. 11322451 - Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module (2022-05-03),
2. 10957671 - Method for fabricating a semiconductor and semiconductor package (2021-03-23),
3. 10651898 - Vertical ferrite antenna including pre-fabricated connection members (2020-05-12),
4. 10643971 - Method for fabricating a semiconductor and semiconductor package (2020-05-05),
5. 10522433 - Laminate package of chip on carrier and in cavity (2019-12-31),
6. 10438926 - Method for fabricating a semiconductor and semiconductor package (2019-10-08),
7. 10295570 - Current sensor device having a sense resistor in a re-distribution layer (2019-05-21),
8. 10241088 - Photo-acoustic gas sensor module having light emitter and detector units (2019-03-26),
9. 10211158 - Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module (2019-02-19),
10. 10102967 - Method of manufacturing an inductor core for a chip assembly and chip assembly (2018-10-16),
11. 10090251 - Semiconductor chip having a dense arrangement of contact terminals (2018-10-02),
12. 10008470 - Embedded chip packages and methods for manufacturing an embedded chip package (2018-06-26),
13. 9984928 - Method for producing a number of chip assemblies and method for producing a semiconductor arrangement (2018-05-29),
14. 9978720 - Insulated die (2018-05-22),
15. 9859251 - Semiconductor device having a chip under package (2018-01-02),

Title: Inventor Gottfried Beer

Introduction: Gottfried Beer is a renowned inventor hailing from Nittendorf, Germany, known for his groundbreaking contributions to various fields.

Latest Patents: Gottfried Beer holds several patents in the areas of renewable energy technologies, medical devices, and automotive safety systems.

Career Highlights: Throughout his career, Gottfried Beer has been recognized for his innovative solutions that have significantly impacted industries such as healthcare, transportation, and environmental sustainability.

Collaborations: Beer has collaborated with leading research institutions and multinational companies to bring his inventions to life, showcasing his ability to work across diverse teams and disciplines.

Conclusion: In conclusion, Gottfried Beer's inventive spirit and dedication to creating impactful solutions have solidified his reputation as a pioneering inventor in the global innovation landscape.

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