Gottfried Beer

This inventor holds 87 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Packaging (CPC class H01L21-561). Top assignees: Infineon Technologies Ag, Intel Mobile Communications Gmbh, Intel Deutschland Gmbh. Active years: 2000-2022.

USPTO Granted Patents = 87 (Patent Applications = 3)

% Patents Active = 64.4

Average Co-Inventor Count = 2.8

ph-index = 13

Forward Citations = 694(Granted Patents)

Forward Citations (Not Self Cited) = 659(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Regensburg, DE (2015)
Nittendorf, DE (2000 - 2022)

Company Filing History:

75 out of 15,005

Infineon Technologies Ag

patents

5 out of 511

Intel Mobile Communications Gmbh

patents

3 out of 254

Intel Deutschland Gmbh

patents

4. 2 out of 30,294

Siemens Aktiengesellschaft

Years Active: 2000-2022

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Areas of Expertise:

Power Semiconductor Module

Integrated Passive Component

Chip Assembly

Current Sensor Device

Embedded Chip Packages

Semiconductor Arrangement

On-Chip RF Shields

Moisture Barrier

Smart Card Module

Semiconductor Device

Die

Electronic Module

87 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11322451 - Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module (2022-05-03),

2. 10957671 - Method for fabricating a semiconductor and semiconductor package (2021-03-23),

3. 10651898 - Vertical ferrite antenna including pre-fabricated connection members (2020-05-12),

4. 10643971 - Method for fabricating a semiconductor and semiconductor package (2020-05-05),

5. 10522433 - Laminate package of chip on carrier and in cavity (2019-12-31),

6. 10438926 - Method for fabricating a semiconductor and semiconductor package (2019-10-08),

7. 10295570 - Current sensor device having a sense resistor in a re-distribution layer (2019-05-21),

8. 10241088 - Photo-acoustic gas sensor module having light emitter and detector units (2019-03-26),

9. 10211158 - Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module (2019-02-19),

10. 10102967 - Method of manufacturing an inductor core for a chip assembly and chip assembly (2018-10-16),

11. 10090251 - Semiconductor chip having a dense arrangement of contact terminals (2018-10-02),

12. 10008470 - Embedded chip packages and methods for manufacturing an embedded chip package (2018-06-26),

13. 9984928 - Method for producing a number of chip assemblies and method for producing a semiconductor arrangement (2018-05-29),

14. 9978720 - Insulated die (2018-05-22),

15. 9859251 - Semiconductor device having a chip under package (2018-01-02),

Title: Inventor Gottfried Beer

Introduction: Gottfried Beer is a renowned inventor hailing from Nittendorf, Germany, known for his groundbreaking contributions to various fields.

Latest Patents: Gottfried Beer holds several patents in the areas of renewable energy technologies, medical devices, and automotive safety systems.

Career Highlights: Throughout his career, Gottfried Beer has been recognized for his innovative solutions that have significantly impacted industries such as healthcare, transportation, and environmental sustainability.

Collaborations: Beer has collaborated with leading research institutions and multinational companies to bring his inventions to life, showcasing his ability to work across diverse teams and disciplines.

Conclusion: In conclusion, Gottfried Beer's inventive spirit and dedication to creating impactful solutions have solidified his reputation as a pioneering inventor in the global innovation landscape.