The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
Apr. 14, 2017
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/051 (2006.01); H01L 23/06 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01); H01L 23/488 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 23/051 (2013.01); H01L 21/4875 (2013.01); H01L 21/56 (2013.01); H01L 23/06 (2013.01); H01L 23/13 (2013.01); H01L 23/142 (2013.01); H01L 23/3135 (2013.01); H01L 23/488 (2013.01); H01L 23/5389 (2013.01); H01L 24/05 (2013.01); H05K 1/185 (2013.01); H01L 23/3121 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05193 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/05684 (2013.01); H01L 2224/18 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32257 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/15153 (2013.01); H05K 3/4652 (2013.01); H05K 3/4697 (2013.01);
Abstract
A package which comprises a chip carrier made of a first material, a body made of a second material differing from the first material and being arranged on the chip carrier so as to form a cavity, a semiconductor chip arranged at least partially in the cavity, and a laminate encapsulating at least one of at least part of the chip carrier, at least part of the body and at least part of the semiconductor chip.